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BS616LV1623TI70 PDF预览

BS616LV1623TI70

更新时间: 2024-11-30 13:47:59
品牌 Logo 应用领域
BSI 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
10页 257K
描述
Standard SRAM, 1MX16, 70ns, CMOS, PDSO48

BS616LV1623TI70 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TSSOP, TSSOP48,.8,20Reach Compliance Code:unknown
风险等级:5.92最长访问时间:70 ns
备用内存宽度:8I/O 类型:COMMON
JESD-30 代码:R-PDSO-G48JESD-609代码:e0
内存密度:16777216 bit内存集成电路类型:STANDARD SRAM
内存宽度:16湿度敏感等级:3
端子数量:48字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH并行/串行:PARALLEL
电源:3 V认证状态:Not Qualified
最大待机电流:0.000005 A最小待机电流:1.5 V
子类别:SRAMs最大压摆率:0.037 mA
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
Base Number Matches:1

BS616LV1623TI70 数据手册

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Very Low Power/Voltage CMOS SRAM  
1M x 16 or 2M x 8 bit switchable  
BSI  
BS616LV1623  
„ FEATURES  
„ DESCRIPTION  
• Vcc operation voltage : 2.7 ~ 3.6V  
• Very low power consumption :  
The BS616LV1623 is a high performance, very low power CMOS Static  
Random Access Memory organized as 1,048,676 words by 16 bits or  
2,097,152 bytes by 8 bits selectable by CIO pin and operates in a Vcc  
range of 2.7V to 3.6V supply voltage.  
Advanced CMOS technology and circuit techniques provide both high  
speed and low power features with a typical CMOS standby current  
of 3.0uA at 3.0V/25oC and maximum access time of 55ns at 3.0V/85oC .  
This device provide three control inputs and three states output drivers  
for easy memory expansion.  
Vcc = 3.0V C-grade: 45mA (@55ns) operating current  
I -grade: 46mA (@55ns) operating current  
C-grade: 36mA (@70ns) operating current  
I -grade: 37mA (@70ns) operating current  
3.0uA (Typ.) CMOS standby current  
• High speed access time :  
-55  
-70  
55ns  
70ns  
The BS616LV1623 has an automatic power down feature, reducing the  
power consumption significantly when chip is deselected.  
The BS616LV1623 is available in 48-pin 12mmx20mm TSOP1 package.  
• Automatic power down when chip is deselected  
• Three state outputs and TTL compatible  
• Fully static operation  
• Data retention supply voltage as low as 1.5V  
• Easy expansion with CE1, CE2 and OE options  
• I/O Configuration x8/x16 selectable by CIO, LB and UB pin  
„ PRODUCT FAMILY  
POWER DISSIPATION  
SPEED  
(ns)  
STANDBY  
Operating  
OPERATING  
TEMPERATURE  
Vcc  
RANGE  
(ICCSB1, Max)  
(ICC, Max)  
PRODUCT FAMILY  
PKG TYPE  
55ns : 3.0~3.6V  
70ns : 2.7~3.6V  
Vcc=3V  
Vcc=3V  
70ns  
Vcc=3V  
10  
55ns  
BS616LV1623TC  
BS616LV1623TI  
+0 O C to +70O  
-40O C to +85O  
C
C
2.7V ~ 3.6V  
2.7V ~ 3.6V  
55 / 70  
55 / 70  
45mA  
36mA TSOP1-48(12mmx20mm)  
uA  
20 uA  
37mA  
46mA  
TSOP1-48(12mmx20mm)  
„ BLOCK DIAGRAM  
„ PIN CONFIGURATIONS  
A19  
A15  
A14  
A13  
A4  
A3  
A2  
A1  
A0  
1
48  
47  
46  
A5  
A6  
A7  
A12  
A11  
A10  
A9  
Address  
Input  
/OE  
/UB  
/LB  
CE2  
SAE  
D15  
D14  
D13  
D12  
Vss  
Vcc  
D11  
D10  
D9  
24  
4096  
Row  
Decoder  
Memory Array  
4096 x 4096  
/CE1  
D0  
Buffer  
A8  
A17  
A7  
D1  
D2  
D3  
Vcc  
CIO  
Vss  
9
10  
A6  
4096  
37  
BS616LV1623TC  
BS616LV1623T I  
Data  
Input  
13  
16(8)  
16(8)  
Column I/O  
D4  
D5  
D0  
Buffer  
.
.
.
.
.
.
.
.
Write Driver  
Sense Amp  
16  
17  
D6  
D7  
A19  
16(8)  
16(8)  
D8  
A8  
256(512)  
Data  
Output  
Buffer  
/WE  
A18  
A17  
A16  
A9  
Column Decoder  
D15  
A10  
A11  
A12  
A13  
27  
25  
CE1  
CE2  
A15  
A14  
16(18)  
24  
WE  
OE  
UB  
Control  
Address Input Buffer  
LB  
A16 A0 A1 A2 A3  
A5  
A18(SAE)  
A4  
CIO  
48-pin 12mmx20mm TSOP1 top view  
Vdd  
Vss  
Brilliance Semiconductor, Inc. reserves the right to modify document contents without notice.  
Revision 1.1  
Jan. 2004  
R0201-BS616LV1623  
1

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