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BR211SM-180 PDF预览

BR211SM-180

更新时间: 2024-02-15 10:18:11
品牌 Logo 应用领域
恩智浦 - NXP 二极管击穿二极管
页数 文件大小 规格书
6页 34K
描述
Breakover diodes

BR211SM-180 技术参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:,Reach Compliance Code:unknown
风险等级:5.92最大转折电压:202 V
JESD-609代码:e0最大通态电压:2.5 V
最高工作温度:70 °C子类别:Silicon Surge Protectors
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
触发设备类型:SILICON SURGE PROTECTOR

BR211SM-180 数据手册

 浏览型号BR211SM-180的Datasheet PDF文件第2页浏览型号BR211SM-180的Datasheet PDF文件第3页浏览型号BR211SM-180的Datasheet PDF文件第4页浏览型号BR211SM-180的Datasheet PDF文件第5页浏览型号BR211SM-180的Datasheet PDF文件第6页 
Philips Semiconductors  
Preliminary specification  
Breakover diodes  
BR211SM series  
GENERAL DESCRIPTION  
QUICK REFERENCE DATA  
A range of bidirectional, breakover  
diodes in a two terminal, surface  
mounting, plastic envelope. These  
devices feature controlled breakover  
voltage and high holding current  
together with high peak current  
SYMBOL  
PARAMETER  
MIN.  
MAX. UNIT  
BR211SM-140 to BR211SM-280  
Breakover voltage  
Holding current  
Non-repetitive peak current  
V(BO)  
IH  
ITSM  
140  
150  
-
280  
-
V
mA  
A
40  
handling  
capability.  
Typical  
application is transient overvoltage  
protection in telecommunications  
equipment.  
OUTLINE - SOD106  
SYMBOL  
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134).  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VD  
Continuous voltage  
Non repetitive peak current  
-
75% of  
V(BO)typ  
40  
V
ITSM1  
10/320 µs impulse equivalent to  
10/700 µs, 1.6 kV voltage impulse  
(CCITT K17)  
-
A
ITSM2  
Non repetitive on-state current half sine wave; t = 10 ms;  
Tj = 70 ˚C prior to surge  
-
15  
A
I2t  
dIT/dt  
I2t for fusing  
tp = 10 ms  
-
-
1.1  
50  
A2s  
A/µs  
Rate of rise of on-state current tp = 10 µs  
after V(BO) turn-on  
Ptot  
PTM  
Tstg  
Ta  
Continuous dissipation  
Peak dissipation  
Ta = 25˚C  
tp = 1 ms; Ta = 25˚C  
-
-
1.2  
50  
W
W
˚C  
˚C  
˚C  
Storage temperature  
- 40  
150  
70  
Operating ambient temperature off-state  
Overload junction temperature on-state  
-
-
Tvj  
150  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Rth j-sp  
Rth j-a  
Zth j-a  
Thermal resistance junction to  
solder point  
-
-
-
-
12  
K/W  
K/W  
K/W  
Thermal resistance junction to pcb mounted; minimum footprint  
100  
2.62  
-
ambient  
Thermal impedance junction to tp = 1 ms  
ambient  
-
August 1996  
1
Rev 1.100  

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