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BM77SPPS3MC2-0007AA PDF预览

BM77SPPS3MC2-0007AA

更新时间： 2024-01-18 02:29:36
品牌 Logo 应用领域
美国微芯 - MICROCHIP 电信电信集成电路
页数 文件大小 规格书
28页 716K
描述
SPECIALTY TELECOM CIRCUIT

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中文翻译

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BM77SPPS3MC2-0007AA 技术参数

是否Rohs认证： 符合生命周期：Not Recommended
包装说明：,Reach Compliance Code：compliant
HTS代码：8542.39.00.01Factory Lead Time：20 weeks
风险等级：7.83JESD-30 代码：R-XQMA-N33
长度：22 mm功能数量：1
端子数量：33最高工作温度：70 °C
最低工作温度：-20 °C封装主体材料：UNSPECIFIED
封装形状：RECTANGULAR封装形式：MICROELECTRONIC ASSEMBLY
峰值回流温度（摄氏度）：NOT SPECIFIED座面最大高度：2.46 mm
表面贴装：YES电信集成电路类型：TELECOM CIRCUIT
温度等级：OTHER端子形式：NO LEAD
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：12 mmBase Number Matches：1

BM77SPPS3MC2-0007AA 数据手册

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30077 新竹科學工業園區工業東七路5號5樓  
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu 30077, Taiwan, R.O.C.  
TEL : 886-3-577-8385 FAX : 886-3-577-8945  
www.issc-tech.com  
BM77SPPx3MC2  
Bluetooth® 4.0 Dual Mode Module  
Features:  
FIGURE 1:  
•
Complete, Fully Certified, Embedded 2.4 GHz  
Bluetooth® Version 4.0 Module  
•
•
•
•
Bluetooth Classic (BR/EDR) and Low Energy (LE)  
Bluetooth SIG Certified  
Onboard embedded Bluetooth Stack  
Transparent UART mode for seamless serial data over  
UART interface  
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•
•
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Easy to configure with Windows GUI or direct by MCU  
Firmware can be field upgradable via UART  
Compact surface mount module: 22 x 12 x 2.4 mm  
Castellated surface mount pads for easy and reliable  
host PCB mounting  
•
•
•
•
Environmentally friendly, RoHS compliant  
Perfect for Portable Battery Operated Devices  
Internal Battery Regulator Circuitry  
Worldwide regulatory certifications  
Operational:  
•
•
•
•
Single operating voltage: 3.2V to 4.3V  
Temperature range: -20 to 70°C  
Simple, UART interface  
Integrated crystal, internal voltage regulator, and  
matching circuitry  
Multiple I/O pins for control and status  
General Description:  
The BM77 is a fully-certified Bluetooth® Version 4.0  
(BR/EDR/LE) module for designers who want to easily add  
dual mode Bluetooth® wireless capability to their products.  
Delivering local connectivity for the Internet of Things (IoT),  
the BM77 bridges your product to Smart Phones and Tablets  
for convenient data transfer, control and access to cloud  
applications.  
•
RF/Analog:  
•
•
•
Frequency: 2.402 to 2.480 GHz  
Receive Sensitivity: -90 dBm (Classic); -92 dBm (LE)  
Power Output: 2 dBm (typ.)  
This Bluetooth SIG certified module provides a complete  
wireless solution with Bluetooth stack onboard, integrated  
antenna, and worldwide radio certifications in a compact  
surface mount package, 22 x 12 x 2.4 mm. It supports GAP,  
SDP, SPP, and GATT profiles. Data is transferred over the  
Bluetooth link by sending/receiving data via transparent  
UART mode, making it easy to integrate with any processor  
or Microcontroller with a UART interface. Configuration is  
made easy using a Windows® based GUI or directly via UART  
by a MCU.  
Data Throughput:  
•
•
50 kilobyte (Classic on Android)  
8 kilobyte (LE on iOS7)  
MAC/Baseband/Higher Layer:  
•
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Secure AES128 encryption  
GAP, SDP, SPP, GATT profiles  
Antenna:  
•
•
Ceramic Chip Antenna (BM77SPPS3MC2)  
External Antenna Connection via RF Pad  
(BM77SPP03MC2)  
Applications:  
•
•
•
•
•
•
•
•
•
Mobile Point of Sales (mPOS)  
LED lighting  
Wearables  
Digital Sports  
Fitness Devices  
Health Care/ Medical  
Automotive Accessories  
Home Automation  
Remote Control Toys  
Compliance:  
•
•
Bluetooth SIG QDID: B021961  
Modular Certified for the United States (FCC) and  
Canada (IC)  
•
•
European R&TTE Directive Assessed Radio Module  
Australia, New Zealand, Korea, Taiwan, Japan  
© 2014 ISSC Technologies Corp.  
Preliminary  
Revision 2.1.1 – June 16, 2015 Page 1  
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