是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | BGA | 包装说明: | VFBGA, |
针数: | 8 | Reach Compliance Code: | compliant |
风险等级: | 5.68 | Is Samacsys: | N |
接口集成电路类型: | INTERFACE CIRCUIT | JESD-30 代码: | R-PBGA-B8 |
长度: | 2.5 mm | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -25 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 认证状态: | Not Qualified |
座面最大高度: | 0.55 mm | 最大供电电压: | 3.6 V |
最小供电电压: | 2.3 V | 标称供电电压: | 3 V |
表面贴装: | YES | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 宽度: | 1.1 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
BH6453GUL | ROHM |
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BH6456GUL | ROHM |
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Silicon monolithic integrated circuits | |
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