BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
8. Application information
Other applications are possible. Please contact your local sales representative for more
information. Application notes are available on the NXP website.
8.1 Application circuit
V
CC
C4
C3
R1 = R
bias
n.c.
3
L1
2
4
X1
C1
C2
X2
6
1
RF_IN
RF_OUT
5
n.c.
001aam382
Components are listed inTable 8.
Fig 1. BGU7044 application circuit
All control and supply lines must be decoupled properly. The decoupling capacitors must
be placed as close to the device as possible.
8.2 Application circuit board layout
VER.2
C4
X1
X2
C3
C2
C1
R1
RF_IN
RF_OUT
L1
IN
75 OHM
OUT
001aao235
PCB material = FR4.
PCB thickness = 1.6 mm.
PCB size = 30 mm 30 mm.
r = 4.5; thickness of copper layer = 35 m.
Components are listed in Table 8
Fig 2. BGU7044 application circuit board layout
BGU7044
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 2 January 2012
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