BGU7044
NXP Semiconductors
1 GHz wideband low-noise amplifier
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min Max Unit
VCC
ICC(tot)
Ptot
supply voltage
RF input AC coupled
configurable with external resistor
Tsp 100 C
0.6 3.5
V
total supply current
total power dissipation
input power
-
-
-
60
mA
mW
dBm
[1]
250
20
Pi
single tone
Tstg
Tj
storage temperature
junction temperature
ambient temperature
65 +150 C
-
150
C
C
kV
Tamb
VESD
40 +85
electrostatic discharge
voltage
Human Body Model (HBM);
according to JEDEC standard
22-A114E
2
-
-
Charged Device Model (CDM);
according to JEDEC standard
22-C101B
1.5
kV
[1] Tsp is the temperature at the solder point of the ground lead.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol Parameter
Conditions
Typ
Unit
Rth(j-sp)
thermal resistance from junction to solder point
240
K/W
7. Characteristics
Table 7.
Characteristics
Tamb = 25 C; typical values at VCC = 3.3 V; ZS = ZL = 75 ; Rbias = 18 ; 40 MHz f1 1000 MHz.
Symbol Parameter
Conditions
Min Typ Max Unit
VCC
supply voltage
RF input AC coupled
3.1 3.3 3.5
V
ICC(tot)
s212
SLsl
total supply current
insertion power gain
slope straight line
flatness of frequency response
noise figure
30
-
34
14
1
0.2
2.8
20
12
13
38
mA
dB
dB
dB
dB
dB
dB
dBm
-
-
-
-
-
-
-
FL
-
NF
-
RLin
RLout
PL(1dB)
input return loss
-
output return loss
-
output power at 1 dB gain
compression
1 GHz
-
[1]
IP3O
output third-order intercept point
-
29
-
dBm
[1] The fundamental frequency (f1) is 1000 MHz. The intermodulation product (IM3) is 2 f2 f1, where
f2 = f1 1 MHz. Input power Pi = 10 dBm.
BGU7044
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 2 January 2012
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