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BD733L05G-C (新产品) PDF预览

BD733L05G-C (新产品)

更新时间： 2023-09-03 20:24:55
品牌 Logo 应用领域
罗姆 - ROHM 电池过电流保护电容器陶瓷电容器稳压器
页数 文件大小 规格书
42页 3123K
描述
BD733L05G-C是消耗电流很低的线性稳压器，非常适用于直接连接电池的车载系统。本IC的耐压为45V，输出电流为50mA，静态电流为28μA(Typ)，输出电压精度为±2%。另外，本IC还内置过电流保护电路，可防止输出短路等导致的IC损坏；内置过热保护电路，可防止IC因过负载状态等导致的热损坏。输出的相位补偿电容可使用低ESR的陶瓷电容器。

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BD733L05G-C (新产品) 数据手册

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BD7xxL05G-C Series  
Absolute Maximum Ratings  
Parameter  
Symbol  
Ratings  
Unit  
Input Supply Voltage(Note 1)  
Output Voltage(Note 2)  
VIN  
VOUT  
-0.3 to +45  
-0.3 to +18  
-40 to +150  
-55 to +150  
150  
V
V
Junction Temperature Range  
Storage Temperature Range  
Tj  
°C  
°C  
°C  
V
Tstg  
Maximum Junction Temperature  
ESD Withstand Voltage (HBM) (Note 3)  
ESD Withstand Voltage (CDM) (Note 4)  
Tjmax  
VESD_HBM  
VESD_CDM  
± 2000  
± 750  
V
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance and power dissipation taken into  
consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.  
(Note 1) Do not exceed Tjmax.  
(Note 2) Do not exceed VIN + 0.3 V.  
(Note 3) ESD susceptibility Human Body Model “HBM”; base on ANSI/ESDA/JEDEC JS001 (1.5 kΩ, 100 pF).  
(Note 4) ESD susceptibility Charged Device Model “CDM”; base on JEDEC JESD22-C101.  
Thermal Resistance(Note 6)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 8)  
2s2p(Note 9)  
SSOP5  
Junction to Ambient  
θJA  
247.3  
43  
155.5  
33  
°C/W  
°C/W  
Junction to Top Characterization Parameter(Note 7)  
ΨJT  
(Note 6) Based on JESD51-2A (Still-Air). Using BD750L05G-C Chips.  
(Note 7) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface  
of the component package.  
(Note 8) Using a PCB board based on JESD51-3.  
(Note 9) Using a PCB board based on JESD51-7.  
Layer Number of  
Measurement Board  
Material  
Board Size  
Single  
FR-4  
114.3 mm x 76.2 mm x 1.57 mmt  
Top  
Copper Pattern  
Thickness  
70 μm  
Footprints and Traces  
Layer Number of  
Measurement Board  
Material  
Board Size  
4 Layers  
FR-4  
114.3 mm x 76.2 mm x 1.6 mmt  
2 Internal Layers  
Top  
Bottom  
Copper Pattern  
Copper Pattern  
Thickness  
70 μm  
Copper Pattern  
Thickness  
35 μm  
Thickness  
70 μm  
Footprints and Traces  
74.2 mm x 74.2 mm  
74.2 mm x 74.2 mm  
www.rohm.com  
© 2022 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0BJB0A600090-1-2  
6/39  
18.Nov.2022 Rev.002  
1...3456789...42

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