5秒后页面跳转
BD6029GU PDF预览

BD6029GU

更新时间: 2024-02-19 18:16:24
品牌 Logo 应用领域
罗姆 - ROHM /
页数 文件大小 规格书
5页 140K
描述
Silicon Monolithic Integrated Circuit

BD6029GU 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:VFBGA,针数:48
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.84
其他特性:ALSO OPERTES AS LDO REGULATOR模拟集成电路 - 其他类型:DUAL SWITCHING CONTROLLER
最大输入电压:5.5 V最小输入电压:2.7 V
标称输入电压:3.6 VJESD-30 代码:S-PBGA-B48
JESD-609代码:e1长度:4.35 mm
功能数量:1端子数量:48
最高工作温度:85 °C最低工作温度:-30 °C
标称输出电压:1.2 V封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装形状:SQUARE
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1 mm
表面贴装:YES切换器配置:SINGLE
温度等级:OTHER端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:10
宽度:4.35 mmBase Number Matches:1

BD6029GU 数据手册

 浏览型号BD6029GU的Datasheet PDF文件第1页浏览型号BD6029GU的Datasheet PDF文件第2页浏览型号BD6029GU的Datasheet PDF文件第3页浏览型号BD6029GU的Datasheet PDF文件第5页 
4/4  
Cautions on use  
(1) Absolute Maximum Ratings  
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break  
down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode  
exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the  
use of fuses, etc.  
(2) Power supply and GND line  
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay attention to the  
interference by common impedance of layout pattern when there are plural power supplies and GND lines. Especially, when  
there are GND pattern for small signal and GND pattern for large current included the external circuits, please separate each  
GND pattern. Furthermore, for all power supply terminals to LSI, mount a capacitor between the power supply and the GND  
terminal. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used  
present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant.  
(3) GND voltage  
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore,  
check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. ( except for VDD4  
terminal )  
(4) Short circuit between terminals and erroneous mounting  
In order to mount LSI on a set PCB, pay thorough attention to the direction and offset of the LSI. Erroneous mounting can break  
down the LSI. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal  
and the power supply or the GND terminal, the LSI can break down.  
(5) Operation in strong electromagnetic field  
Be noted that using LSI in the strong electromagnetic field can malfunction them.  
(6) Input terminals  
In terms of the construction of LSI, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic  
element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal.  
Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the  
GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no  
power supply voltage is applied to the LSI. In addition, even if the power supply voltage is applied, apply to the input terminals a  
voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.  
(7) External capacitor  
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in  
the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.  
(8) Thermal shutdown circuit (TSD)  
This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher,  
the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the  
LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not  
continuously use the LSI with this circuit operating or use the LSI assuming its operation.  
(9) Thermal design  
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual  
states of use.  
(10) LDO  
Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because it  
has the possibility that a operation becomes unstable.  
(11) DC/DC converter  
Please select the low DCR inductors to decrease power loss for DC/DC converter.  
(12) About the pin for the test, the un-use pin  
Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a  
function manual and an application notebook.  
And, as for the pin that doesn't specially have an explanation, ask our company person in charge.  
(13) About the rush current  
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal  
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of  
ground wiring, and routing of wiring.  
(14) About the function description or application note or more.  
The function description and the application notebook are the design materials to design a set. So, the contents of the  
materials aren't always guaranteed. Please design application by having fully examination and evaluation include the  
external elements.  
REV. A  

与BD6029GU相关器件

型号 品牌 获取价格 描述 数据表
BD6029GU_10 ROHM

获取价格

Power Supply for CCD Camera Module
BD6029GU-E2 ROHM

获取价格

Switching Regulator
BD6030GSW ROHM

获取价格

Negative power supply for CCD camera of mobile phones
BD6039GU ROHM

获取价格

Power Supply for CCD Camera Module
BD6039GU-E2 ROHM

获取价格

Power Supply for CCD Camera Module
BD6040GUL ROHM

获取价格

Charger Protection IC with Internal FET
BD6041GUL ROHM

获取价格

Silicon Monolithic Integrated Circuit
BD6041GUL_11 ROHM

获取价格

Silicon Monolithic Integrated Circuit
BD6041GUL-E2 ROHM

获取价格

Buffer/Inverter Based Peripheral Driver, 1.2A, PBGA9, 1.60 X 1.60 MM, 0.55 MM HEIGHT, ROHS
BD6042GUL ROHM

获取价格

Silicon Monolithic Integrated Circuit