Model BD60120N50100AHF
Rev H
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must
be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may
not meet published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green
standards and ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as
varying pick and place equipment tolerances.
With No DC Bias
With DC Bias
Plated thru
hole to
ground
.33
3x Transmission
3x Transmission
Line
Line
Plated thru
holes to ground
3x .29
3x 0.25
.33
.22
3x .29
.50
0.30
0.25
3x 0.25
0.50
.22
.50
0.25
0.50
Circuit pattern
Footprint Pad(s)
Solder Resist
Dimensions are in Millimeters
Recommended mounting footprint for
8mil thick, Dk 3.25 PCB
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Millimeters
Mounting Footprint
4