BCX5616Q
Absolute Maximum Ratings (@ TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VCBO
VCEO
VEBO
IC
Value
100
80
Unit
V
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
V
6
V
Continuous Collector Current
Peak Pulse Collector Current
Continuous Base Current
Peak Pulse Base Current
1
A
2.0
100
200
ICM
IB
mA
IBM
Thermal Characteristics (@ TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
(Note 5)
(Note 6)
(Note 7)
(Note 5)
(Note 6)
(Note 7)
(Note 8)
1
Power Dissipation
1.5
W
PD
2.0
125
Thermal Resistance, Junction to Ambient Air
83
60
°C/W
RθJA
Thermal Resistance, Junction to Lead
13
°C/W
°C
RθJL
Operating and Storage Temperature Range
-55 to +150
TJ, TSTG
ESD Ratings (Note 9)
Characteristic
Electrostatic Discharge - Human Body Model
Electrostatic Discharge - Machine Model
Symbol
Value
Unit
V
JEDEC Class
ESD HBM
ESD MM
4,000
400
3A
C
V
Notes:
5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under
still air conditions whilst operating in a steady-state.
6. Same as note (6), except the device is mounted on 25mm x 25mm 1oz copper.
7. Same as note (6), except the device is mounted on 50mm x 50mm 1oz copper.
8. Thermal resistance from junction to solder-point (on the exposed collector pad).
9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
2 of 7
www.diodes.com
November 2020
© Diodes Incorporated
BCX5616Q
Datasheet number: DS37024 Rev. 3 – 2