CYW89071
Contents
1. Overview ........................................................................4
1.1 Major Features ......................................................4
1.2 Block Diagram .......................................................6
1.3 Automotive Usage Model ......................................7
2. Integrated Radio Transceiver ......................................8
2.1 Transmitter Path ....................................................8
2.2 Receiver Path ........................................................8
2.3 Local Oscillator Generation ...................................8
2.4 Calibration .............................................................8
2.5 Internal LDO ..........................................................9
3. Bluetooth Baseband Core .........................................10
3.1 Transmit and Receive Functions .........................10
3.2 Bluetooth 4.1 + EDR Features ............................10
3.3 Frequency Hopping Generator ............................10
3.4 Link Control Layer ...............................................11
3.5 Test Mode Support ..............................................11
3.6 Power Management Unit .....................................11
3.7 Adaptive Frequency Hopping ..............................13
3.8 Collaborative Coexistence ...................................13
3.9 Serial Enhanced Coexistence Interface ..............13
4. Microprocessor Unit ...................................................15
4.1 NVRAM Configuration Data and Storage ............15
4.2 EEPROM .............................................................15
4.3 External Reset .....................................................15
4.4 One-Time Programmable Memory ......................16
5. Peripheral Transport Unit ..........................................17
5.1 PCM Interface .....................................................17
5.2 HCI Transport Detection Configuration ...............19
5.3 UART Interface ....................................................19
5.4 SPI .......................................................................20
6. Frequency References ...............................................21
6.1 Crystal Interface and Clock Generation ..............21
6.2 Crystal Oscillator .................................................22
6.3 External Frequency Reference ............................22
6.4 Frequency Selection ............................................23
6.5 Frequency Trimming ...........................................23
6.6 LPO Clock Interface ............................................24
7. Pin and Signal Descriptions ......................................25
7.1 Pin Descriptions ..................................................25
8. Ball Grid Arrays ..........................................................27
9. Electrical Characteristics ...........................................28
9.1 Electrostatic Discharge Specifications ................30
9.2 RF Specifications ................................................33
9.3 Timing and AC Characteristics ............................36
9.4 I2S Interface ........................................................43
10. Mechanical Information ...........................................46
10.1 Tape, Reel, and Packing Specification ..............47
11. Package Thermal Characteristics ...........................48
11.1 Thermal Characteristics ....................................48
12. Ordering Information ................................................49
13. References ................................................................49
Document History ..........................................................50
Document Number: 002-14857 Rev. *H
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