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BCM48BF240T300A00 PDF预览

BCM48BF240T300A00

更新时间: 2024-11-18 22:04:23
品牌 Logo 应用领域
VICOR /
页数 文件大小 规格书
21页 2147K
描述
BCM BUS CONVERTER 24V 300W

BCM48BF240T300A00 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:2.36
模拟集成电路 - 其他类型:DC-DC UNREGULATED POWER SUPPLY MODULE最大输入电压:55 V
最小输入电压:38 V标称输入电压:48 V
JESD-30 代码:R-XQMA-J60JESD-609代码:e4
长度:32.5 mm湿度敏感等级:4
功能数量:1输出次数:1
端子数量:60最高工作温度:125 °C
最低工作温度:-40 °C最大输出电压:27.5 V
最小输出电压:19 V标称输出电压:24 V
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):NOT SPECIFIED
座面最大高度:6.98 mm表面贴装:YES
技术:HYBRID温度等级:AUTOMOTIVE
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:J BEND
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
最大总功率输出:300 W微调/可调输出:NO
宽度:22 mm

BCM48BF240T300A00 数据手册

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BCM® Bus Converter  
BCM48Bx240y300A00  
S
®
C
NRTL US  
C
US  
Isolated Fixed Ratio DC-DC Converter  
Features & Benefits  
Product Ratings  
48VDC – 24.0VDC 300W Bus Converter  
VIN = 48V (38 – 55V)  
POUT= up to 300W  
K = 1/2  
High efficiency (>94%) reduces system power consumption  
VOUT = 24V (19.0 – 27.5V)  
(no load)  
High power density (>1022W/in3)  
reduces power system footprint by > 40%  
Description  
Contains built-in protection features:  
„Undervoltage  
The VI Chip® bus converter is a high efficiency (>94%) Sine  
Amplitude Converter™ (SAC™) operating from a 38 to 55VDC  
primary bus to deliver an isolated, ratiometric output voltage from  
19.0 to 27.5VDC. The Sine Amplitude Converter offers a low AC  
impedance beyond the bandwidth of most downstream regulators;  
therefore capacitance normally at the load can be located at the  
input to the Sine Amplitude Converter. Since the transformation  
ratio of the BCM48Bx240y300A00 is 1/2, the capacitance value  
can be reduced by a factor of 4x, resulting in savings of board area,  
materials and total system cost.  
„Overvoltage Lockout  
„Overcurrent Protection  
„Short circuit Protection  
„Overtemperature Protection  
Provides enable/disable control,  
internal temperature monitoring  
Can be paralleled to create multi-kW arrays  
The BCM48BF240y300A00 is provided in a VI Chip package  
compatible with standard pick-and-place and surface mount  
assembly processes. The co-molded VI Chip package provides  
enhanced thermal management due to a large thermal interface  
area and superior thermal conductivity. The high conversion  
efficiency of the BCM48Bx240y300A00 increases overall  
system efficiency and lowers operating costs compared to  
conventional approaches.  
Typical Applications  
High-End Computing Systems  
Automated Test Equipment  
High-Density Power Supplies  
Communications Systems  
Part Numbering  
Product Number  
Package Style (x)  
Product Grade (y)  
F = J-Lead  
T = –40 to 125°C  
M = –55 to 125°C  
BCM48Bx240y300A00  
T = Through hole  
For Storage and Operating Temperatures see General Characteristics  
Typical Application  
PC  
TM  
enable / disable  
switch  
L
O
A
D
®
BCM  
Bus Converter  
SW1  
F1  
+IN  
+OUT  
VIN  
-OUT  
-IN  
BCM® Bus Converter  
Page 1 of 21  
Rev 1.5  
01/2021  

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