Datasheet > BCD352F110T300A00

BCD352F110T300A00

更新时间： 2024-09-29 22:04:19

品牌	Logo	应用领域
VICOR		/
页数	文件大小	规格书
11页	1584K
描述
HV BCM BUS CONVERTER EVAL BOARD

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中文翻译

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数据手册

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End of Life - BCM352x110T300B00 Recommended

BCM352F110T300A00

BCM352T110T300A00

(Formerly VIB0001TFJ)

BCM

Bus Converter

• 352 V to 11 V V•I Chip^TMConverter

• 300 Watt (450 Watt for 1 ms)

• High density – up to 1017 W/in³

• Small footprint – 260 W/in²

• Low weight – 0.5 oz (14 g)

• Typical efficiency 95%

• 125°C operation

• <1 µs transient response

• >3.5 million hours MTBF

• No output filtering required

Vin = 330 - 365 V

Vout = 10.3 - 11.4 V

Iout = 28.0 A

K = 1/32

Rout = 12.5 m max

• ZVS / ZCS isolated sine

amplitude converter

Product Description

Absolute Maximum Ratings

The V•I Chip bus converter is a high efficiency (>95%),

narrow input range Sine Amplitude Converter^TM(SAC^TM)

operating from a 330 to 365 Vdc primary bus to deliver

an isolated low voltage secondary. The off-line BCM

provides an isolated 10.3 -11.4 V distribution bus and is

ideal for use in silver boxes and PFC front ends. Due to

the fast response time and low noise of the BCM, the

need for limited life aluminum electrolytic or tantalum

capacitors at the input of POL converters is reduced—or

eliminated—resulting in savings of board area, materials

and total system cost.

Parameter

Values

-1.0 to 400

500

Unit

Vdc

Notes

+In to -In

For 100 ms

PC to -In

-0.3 to 7.0

-0.5 to 16.0

4,242

+Out to -Out

Isolation voltage

Output current

Peak output current

Output power

Peak output power

Input to Output

Continuous

For 1 ms

Continuous

For 1 ms

MSL 5

42.0

300

450

The BCM achieves a power density of 1017 W/in³in

a V•I Chip package compatible with standard pick-and-

place and surface mount assembly processes. The

V•I Chip package provides flexible thermal management

through its low junction-to-case and junction-to-board

thermal resistance. Owing to its high conversion

efficiency and safe operating temperature range, the

BCM does not require a discrete heat sink in typical

applications. Low junction-to-case and junction-to-lead

thermal impedances assure low junction temperatures

and long life in the harshest environments.

225

°C

Case temperature

245

°C

MSL 6

Operating junction temperature⁽¹⁾

Storage temperature

-40 to 125

°C

T-Grade

°C

T-Grade

Note:

(1) The referenced junction is defined as the semiconductor having the highest temperature.

This temperature is monitored by a shutdown comparator.

vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00

Rev. 1.6

Page 1 of 11

12 3 4 5 6 7...11

中文翻译

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