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BC517_07 PDF预览

BC517_07

更新时间: 2024-01-16 16:41:10
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管达林顿晶体管
页数 文件大小 规格书
6页 78K
描述
Darlington Transistors

BC517_07 数据手册

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BC517  
Darlington Transistors  
NPN Silicon  
Features  
http://onsemi.com  
These are Pb−Free Devices*  
COLLECTOR 1  
MAXIMUM RATINGS  
BASE  
2
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
CollectorEmitter Voltage  
Collector Current − Continuous  
Symbol  
Value  
30  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
V
CES  
V
CB  
40  
EMITTER 3  
V
EB  
10  
I
C
1.0  
Total Power Dissipation @ T = 25°C  
P
625  
12  
mW  
mW/°C  
A
D
TO−92  
CASE 29  
STYLE 17  
Derate above T = 25°C  
A
Total Power Dissipation @ T = 25°C  
P
D
1.5  
12  
W
mW/°C  
A
Derate above T = 25°C  
A
1
Operating and Storage Junction  
Temperature Range  
T , T  
−55 to +150  
°C  
J
stg  
1
2
2
3
3
STRAIGHT LEAD  
BULK PACK  
BENT LEAD  
TAPE & REEL  
AMMO PACK  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
200  
Unit  
°C/W  
°C/W  
Thermal Resistance, Junction−to−Ambient  
Thermal Resistance, Junction−to−Case  
R
q
JA  
JC  
R
83.3  
MARKING DIAGRAM  
q
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
BC  
517  
AYWW G  
G
A
Y
= Assembly Location  
= Year  
WW  
= Work Week  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Device  
BC517G  
Package  
Shipping  
TO−92  
(Pb−Free)  
5000 Units / Bulk  
2000 / Tape & Reel  
2000 / Ammo Pack  
BC517RL1G  
BC517ZL1G  
TO−92  
(Pb−Free)  
TO−92  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
March, 2007 − Rev. 4  
BC517/D  

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