BC3603
Pin Description
Pin No.
Pin Name
Type
PWR
AI
Description
1
2
AVDD1
RFIN
Analog power supply
RF LNA input
3
RFOUT
VSSRF
AVDD2
XO
AO
RF power amplifier output
RF ground
4
PWR
PWR
AO
5
Analog power supply
Crystal oscillator output
Crystal oscillator input
Digital power supply
6
7
XI
AI
8
DVDD
CLDO
GIO1
PWR
PWR
DI/O
DI
9
LDO output, connected to a bypass capacitor
Multi-function I/O 1
10
11
12
13
14
15
16
—
CSN
SPI chip select input, low active
SPI clock input
SCK
DI
GIO2
DI/O
DI/O
DI/O
—
Multi-function I/O 2
SDIO
GIO3
SPI data input/output
Multi-function I/O 3
TEST
VSS/EP(1)
Not connected, leave floating
Exposed pad, must be connected to ground
PWR
Legend: DI: Digital Input;
AO: Analog Output;
DI/O: Digital Input/Output;
PWR: Power
AI: Analog Input;
1. The VSS/EP pin is located at the exposed pad.
2. The backside plate of EP shall be well soldered to ground on PCB, otherwise it will downgrade RF
performance.
Absolute Maximum Ratings
Supply Voltage..........................................................................................................................VSS-0.3V to VSS+3.6V
Voltage on I/O Ports.................................................................................................................VSS-0.3V to VDD+0.3V
Storage Temperature ........................................................................................................................... -60°C to 150°C
Operating Temperature ......................................................................................................................... -40°C to 85°C
ESD HBM.......................................................................................................................................................... ±2KV
The device is ESD sensitive. HBM (Human Body Mode) is based on MIL-STD-883.
Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings”
may cause substantial damage to the device. Functional operation of this device at other conditions beyond
those listed in the specification is not implied and prolonged exposure to extreme conditions may affect
device reliability.
Rev. 1.10
3
August 11, 2023