PRELIMINARY
V•I Chip Bus Converter Module
BCM
TM
V•I Chip – BCM
Bus Converter Module
• 48 V to 6 V V•I Chip Converter
• 240 Watt (360 Watt for 1 ms)
• High density – 974 W/in3
• Small footprint – 220 W/in2
• Low weight – 0.5 oz (14 g)
B048K060T24
K indicates BGA configuration. For other
mounting options see Part Numbering below.
• Typical efficiency 95%
• 125°C operation
©
• <1 µs transient response
• 3.5 million hours MTBF
• No output filtering required
Vin = 38 - 55 V
Vout = 4.75 - 6.87 V
Iout = 40.0 A
K = 1/8
Rout = 7.5 mΩ max
• ZVS/ZCS isolated sine
amplitude converter
• Surface mount BGA or J-Lead
packages
Actual size
Product Description
Absolute Maximum Ratings
The V•I Chip Bus Converter Module (BCM) is a high
efficiency (>95%), narrow input range Sine Amplitude
Converter (SAC) operating from a 38 to 55 Vdc primary
bus to deliver an isolated 4.75 V to 6.87 V secondary.
The BCM may be used to power non-isolated POL
converters or as an independent 4.75 – 6.87 V source.
Due to the fast response time and low noise of the
BCM, the need for limited life aluminum electrolytic or
tantalum capacitors at the input of POL converters is
reduced—or eliminated—resulting in savings of board
area, materials and total system cost.
Parameter
+In to -In
Values
-1.0 to 60
100
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
A
Notes
+In to -In
For 100 ms
PC to -In
-0.3 to 7.0
-0.5 to 15.0
2,250
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Input to Output
Continuous
For 1 ms
42.4
60.0
A
240
W
Continuous
For 1 ms
360
W
The BCM achieves a power density of 974 W/in3 and
may be surface mounted with a profile as low as 0.16"
(4 mm) over the PCB. Its V•I Chip power package is
compatible with onboard or inboard surface mounting.
The V•I Chip package provides flexible thermal
management through its low Junction-to-Case and
Junction-to-BGA thermal resistance. Owing to its high
conversion efficiency and safe operating temperature
range, the BCM does not require a discrete heat sink in
typical applications. It is also available with heat sink
options, assuring low junction temperatures and long
life in the harshest environments.
208
°C
During reflow
Operating junction temperature(1) -40 to 125
-55 to 125
°C
°C
T - Grade
M - Grade
Storage temperature
-40 to 150
-65 to 150
°C
°C
T - Grade
M - Grade
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
B
048 K 060 T
24
Output Voltage
Designator
(=VOUT x10)
Output Power
Designator
(=POUT/10)
Bus Converter
Module
Input Voltage
Designator
Configuration Options
Product Grade Temperatures (°C)
F
= Onboard (Figure 20)
Grade
Storage Operating
K = Inboard (Figure 19)
T
M
-40 to150 -40 to125
-65 to150 -55 to125
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K060T24
Rev. 1.0
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