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ATS673LSETN-LT PDF预览

ATS673LSETN-LT

更新时间： 2024-02-04 12:52:56
品牌 Logo 应用领域
急速微 - ALLEGRO 传感器
页数 文件大小 规格书
20页 666K
描述
Self-Calibrating TPOS Gear Tooth Sensor Optimized for Automotive Cam Sensing Applications

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ATS673LSETN-LT 技术参数

是否Rohs认证： 符合生命周期：Obsolete
包装说明：PLASTIC, SIP-4Reach Compliance Code：unknown
风险等级：5.84主体宽度：7 mm
主体高度：7.9 mm主体长度或直径：10 mm
外壳：PLASTICJESD-609代码：e3
最大测量范围（毫米）：2.5 mm最小测量范围（毫米）：0.5 mm
安装特点：THROUGH HOLE MOUNT端子数量：4
最大工作电流：11 mA最高工作温度：150 °C
最低工作温度：-40 °C输出极性：INVERTING
输出范围：450mV输出类型：ANALOG VOLTAGE
封装主体材料：PLASTIC/EPOXY封装等效代码：SIP4,.25,50
封装形状/形式：ROUND电源：12 V
响应时间：0.9 µs传感器/换能器类型：PROXIMITY SENSOR,HALL EFFECT
子类别：Other Sensors最大供电电压：26.5 V
最小供电电压：3.3 V表面贴装：NO
技术：BICMOS端子面层：Matte Tin (Sn)
端接类型：SOLDERBase Number Matches：1

ATS673LSETN-LT 数据手册

 浏览型号ATS673LSETN-LT的Datasheet PDF文件第13页浏览型号ATS673LSETN-LT的Datasheet PDF文件第14页浏览型号ATS673LSETN-LT的Datasheet PDF文件第15页浏览型号ATS673LSETN-LT的Datasheet PDF文件第17页浏览型号ATS673LSETN-LT的Datasheet PDF文件第18页浏览型号ATS673LSETN-LT的Datasheet PDF文件第19页 
ATS673 and ATS674  
Self-Calibrating TPOS Gear Tooth Sensor Optimized for Automotive Cam Sensing Applications  
repower the device at each test at different air gaps. This ensures  
that self-calibration occurs for each installation condition.  
See the Operating Characteristics table and the charts in the  
Characteristic Data: Relative Timing Accuracy section for  
performance information.  
Accuracy  
While the update algorithm will allow the sensor devices to  
adapt to typical air gap variations, major changes in air gap can  
adversely affect switching performance. When characterizing  
sensor performance over a significant air gap range, be sure to  
Sensor Evaluation: EMC  
Characterization Only  
Test Name*  
ESD – Human Body Model  
ESD – Machine Model  
Conducted Transients  
Direct RF Injection  
Reference Specification  
AEC-Q100-002  
AEC-Q100-003  
ISO 7637-1  
ISO 11452-7  
ISO 11452-4  
ISO 11452-3  
Bulk Current Injection  
TEM Cell  
*Please contact Allegro for EMC performance  
Mechanical Information  
Component  
Material  
Description  
Value  
Back-biasing Magnet  
Rare Earth  
South pole behind IC  
Sensor Package Material  
Leads  
Thermoset Epoxy  
Copper  
Maximum Temperature  
170°Ca  
Solder, Tin/Lead 90/10b  
aTemperature excursions of up to 260°C for 2 minutes or less are permitted (based on delamination studies).  
bIndustry accepted soldering techniques are acceptable for this package as long as the indicated maximum temperature is not exceeded.  
Related Documents  
Documents that can be found on the Allegros web site,:  
www.allegromicro.com:  
• Storage of Semiconductor Devices (Pub 26011)  
• Hall Effect Applications Guide (Pub 27701)  
• Definition of Terms (Pub 26004)  
• Applications Note: Back-Biased Packaging Advances (SE, SG  
& SH versus SA & SB)  
• Hall-Effect Devices: Soldering, Gluing, Potting, Encapsulating,  
and Lead forming (AN27703.1)  
Allegro MicroSystems, Inc.  
16  
115 Northeast Cutoff, Box 15036  
ATS673LSE-DS  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
www.allegromicro.com  
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