是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | QFN | 包装说明: | HVQCCN, |
针数: | 8 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.84 |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | S-XQCC-N8 |
长度: | 3 mm | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 80 °C |
最低工作温度: | -10 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 认证状态: | Not Qualified |
座面最大高度: | 1 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 温度等级: | COMMERCIAL EXTENDED |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 宽度: | 3 mm |
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