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ATA556711-TASY PDF预览

ATA556711-TASY

更新时间: 2024-01-29 09:09:51
品牌 Logo 应用领域
爱特美尔 - ATMEL 电信电信集成电路
页数 文件大小 规格书
34页 469K
描述
Telecom Circuit, 1-Func, LEAD FREE, MICRO, MODULE

ATA556711-TASY 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:DMA包装说明:LEAD FREE, MICRO, MODULE
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84JESD-30 代码:R-XDMA-N
JESD-609代码:e3湿度敏感等级:1
功能数量:1端子数量:8
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY认证状态:Not Qualified
子类别:Other Telecom ICs最大压摆率:0.00004 mA
表面贴装:NO电信集成电路类型:TELECOM CIRCUIT
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

ATA556711-TASY 数据手册

 浏览型号ATA556711-TASY的Datasheet PDF文件第24页浏览型号ATA556711-TASY的Datasheet PDF文件第25页浏览型号ATA556711-TASY的Datasheet PDF文件第26页浏览型号ATA556711-TASY的Datasheet PDF文件第28页浏览型号ATA556711-TASY的Datasheet PDF文件第29页浏览型号ATA556711-TASY的Datasheet PDF文件第30页 
ATA5567  
9. Ordering Information(1)  
ATA5567 a b M c c - x x x Package  
Drawing  
- DDW  
- DDT  
- DBW  
- Die on wafer, 6” unsawn wafer, thickness 300 µm  
- Die in tray (waffle pack), thickness 300 µm  
- Die on solder-bumped wafer, thickness 390 µm  
Sn63Pb37 on 5 µm Ni/Au, height 70 µm  
Figure 10-2 on page 29  
Figure 10-3 on page 29  
- TASY  
- PAE  
- SO8 package (lead-free)  
Figure 10-6 on page 32  
Figure 10-4 on page 30  
- NOA3 micromodule (lead-free)  
Customer ID(2)  
- Atmel standard (corresponds to “0”)  
- Customer “X” unique ID code(1)  
- 2 pads without on-chip capacitor  
- 4 pads with on-chip 75 pF capacitor  
- Micromodule with 330 pF capacitor  
M01  
11  
Figure 10-1 on page 28  
Figure 10-2 on page 29  
Figure 10-4 on page 30  
14  
15  
01  
- 2 pads without capacitor, damping during initialization Figure 10-1 on page 28  
Notes: 1. For available order codes, contact your local Atmel Sales/Marketing office.  
2. Unique customer ID code programming shown in Figure 3-4 on page 6 is linked to a minimum order quantity of 1 million  
parts per year.  
9.1  
9.2  
Ordering Examples (Recommended)  
ATA556711-DDW  
Tested die on unsawn 6” wafer, thickness 300 µm, no on-chip capacitor,  
no damping during POR initialization; especially for ISO 11784/785 and  
access control applications  
Available Order Codes  
ATA556711-DDW, DDT, TASY  
ATA556714-DDW  
ATA556715-PAE  
New order codes will be created by customer request if order quantities are over 250k pieces.  
27  
4874D–RFID–05/06  

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