AS7C4096
AS7C34096
®
Functional description
The AS7C4096 and AS7C34096 are high-performance CMOS 4,194,304-bit Static Random Access Memory (SRAM) devices
organized as 524,288 words × 8 bits. They are designed for memory applications where fast data access, low power, and simple
interfacing are desired.
Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 5/6/7/8 ns are
ideal for high-performance applications. The chip enable input CE permits easy memory expansion with multiple-bank memory
systems.
When CE is high the device enters standby mode. The AS7C4096 is guaranteed not to exceed 110 mW power consumption in
CMOS standby mode.
A write cycle is accomplished by asserting write enable (WE) and chip enable (CE). Data on the input pins I/O1–I/O8 is written
on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive I/O pins
only after outputs have been disabled with output enable (OE) or write enable (WE).
A read cycle is accomplished by asserting output enable (OE) and chip enable (CE), with write enable (WE) high. The chip drives
I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or write
enable is active, output drivers stay in high-impedance mode.
All chip inputs and outputs are TTL-compatible, and operation is from a single supply voltage. Both devices are available in the
industry standard 400-mil 36-pin SOJ and 44-pin TSOP 2 packages.
Absolute maximum ratings
Parameter
Device
Symbol
Vt1
Min
–1
Max
+7.0
+5.0
VCC +0.5
1.0
Unit
V
AS7C4096
AS7C34096
Voltage on VCC relative to GND
Vt1
–0.5
–0.5
–
V
Voltage on any pin relative to GND
Power dissipation
Vt2
V
PD
W
°C
°C
mA
Storage temperature (plastic)
Temperature with VCC applied
DC current unto output (low)
Tstg
–65
–55
–
+150
+125
20
Tbias
IOUT
NOTE: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional oper-
ation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
Truth table
CE
H
L
WE
X
OE
X
Data
High Z
High Z
DOUT
DIN
Mode
Standby (ISB, ISB1
)
H
H
L
Output disable (ICC)
Read (ICC)
L
H
L
L
X
Write (ICC)
Key: X = Don’t care, L = Low, H = High
11/28/01; v.1.7
Alliance Semiconductor
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