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AS7C33256PFS36A-133BC PDF预览

AS7C33256PFS36A-133BC

更新时间: 2024-01-04 16:32:06
品牌 Logo 应用领域
ALSC 静态存储器内存集成电路
页数 文件大小 规格书
14页 373K
描述
Standard SRAM, 256KX36, 10ns, CMOS, PBGA119, 14 X 20 MM, BGA-119

AS7C33256PFS36A-133BC 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:BGA包装说明:LBGA, BGA119,7X17,50
针数:119Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.63最长访问时间:10 ns
其他特性:FLOW-THROUGH OR PIPELINED ARCHITECTUREI/O 类型:COMMON
JESD-30 代码:R-PBGA-B119JESD-609代码:e0
长度:22 mm内存密度:9437184 bit
内存集成电路类型:STANDARD SRAM内存宽度:36
功能数量:1端子数量:119
字数:262144 words字数代码:256000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:256KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA119,7X17,50
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5/3.3,3.3 V认证状态:Not Qualified
座面最大高度:1.7 mm最大待机电流:0.03 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.425 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

AS7C33256PFS36A-133BC 数据手册

 浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第1页浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第2页浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第3页浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第5页浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第6页浏览型号AS7C33256PFS36A-133BC的Datasheet PDF文件第7页 
AS7C33256PFS32A  
AS7C33256PFS36A  
®
Functional description  
The AS7C33256PFS32A and AS7C33256PFS36A are high-performance CMOS 8-Mbit synchronous Static Random Access Memory (SRAM)  
devices organized as 262,144 words x 32 or 36 bits, and incorporate a two-stage register-register pipeline for highest frequency on any given  
technology.  
Timing for these devices is compatible with existing Pentium® synchronous cache specifications. This architecture is suited for ASIC, DSP  
1
(TMS320C6X), and PowerPC-based systems in computing, datacomm, instrumentation, and telecommunications systems.  
Fast cycle times of 6/6.6/7.5/10 ns with clock access times (t ) of 3.5/3.8/4.0/5.0 ns enable 166, 150, 133 and 100 MHz bus frequencies.  
CD  
Two-chip enable and three-chip enable (CE) inputs permit versatility and easy memory expansion. Burst operation is initiated in one of two  
ways: the controller address strobe (ADSC), or the processor address strobe (ADSP). The burst advance pin (ADV) allows subsequent internally  
generated burst addresses.  
Read cycles are initiated with ADSP (regardless of WE and ADSC) using the new external address clocked into the on-chip address register  
when ADSP is sampled Low, the chip enables are sampled active, and the output buffer is enabled with OE. In a read operation the data accessed  
by the current address, registered in the address registers by the positive edge of CLK, are carried to the data-out registers and driven on the  
output pins on the next positive edge of CLK. ADV is ignored on the clock edge that samples ADSP asserted, but is sampled on all subsequent  
clock edges. Address is incremented internally for the next access of the burst when ADV is sampled Low, and both address strobes are High.  
Burst mode is selectable with the LBO input. With LBO unconnected or driven High, burst operations use a Pentium® count sequence. With  
LBO driven LOW, the device uses a linear count sequence suitable for PowerPCand many other applications.  
Write cycles are performed by disabling the output buffers with OE and asserting a write command. A global write enable GWE writes all 32/  
36 bits regardless of the state of individual BW[a:d] inputs. Alternately, when GWE is High, one or more bytes may be written by asserting  
BWE and the appropriate individual byte BWn signal(s).  
BWn is ignored on the clock edge that samples ADSP Low, but is sampled on all subsequent clock edges. Output buffers are disabled when BWn  
is sampled LOW (regardless of OE). Data is clocked into the data input register when BWn is sampled Low. Address is incremented internally to  
the next burst address if BWn and ADV are sampled Low.  
Read or write cycles may also be initiated with ADSC instead of ADSP. The differences between cycles initiated with ADSC and ADSP follow.  
• ADSP must be sampled HIGH when ADSC is sampled LOW to initiate a cycle with ADSC.  
• WE signals are sampled on the clock edge that samples ADSC LOW (and ADSP High).  
• Master chip enable CE0 blocks ADSP, but not ADSC.  
AS7C33256PFS32A and AS7C33256PFS36A family operates from a core 3.3V power supply. I/Os use a separate power supply that can operate  
at 2.5V or 3.3V. These devices are available in a 100-pin 14 × 20 mm TQFP package and in a 119-pin 14 × 20 mm BGA package.  
Capacitance  
Parameter  
Input capacitance  
I/O capacitance  
Symbol  
CIN  
Signals  
Address and control pins  
I/O pins  
Test conditions  
VIN = 0V  
Max  
5
Unit  
pF  
CI/O  
VIN = VOUT = 0V  
7
pF  
Write enable truth table (per byte)  
GWE  
BWE  
BWn  
WEn  
T
L
X
L
X
L
H
T
H
H
L
X
H
F*  
F*  
H
ꢀꢁꢂꢃꢄX = Don’t Care, L = Low, H = High, T = True, F = False; *= Valid read; n = a, b, c, d; WE, WEn = internal write signal.  
Burst order table  
Interleaved Burst Order  
Linear Burst Order  
LBO=0  
LBO=1  
Starting Address 00  
First increment 01  
Second increment 10  
Third increment 11  
01  
00  
11  
10  
10  
11  
00  
01  
11  
10  
01  
00  
Starting Address 00  
First increment 01  
Second increment 10  
Third increment 11  
01  
10  
11  
00  
10  
11  
00  
01  
11  
00  
01  
10  
1 PowerPC is a trademark International Business Machines Corporation.  
3/25/02; v.1.8  
Alliance Semiconductor  
P. 4 of 14  
 

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