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AS7C31024-20JC PDF预览

AS7C31024-20JC

更新时间: 2024-02-11 15:54:56
品牌 Logo 应用领域
ALSC 存储内存集成电路静态存储器光电二极管
页数 文件大小 规格书
9页 199K
描述
5V/3.3V 128K x 8 CMOS SRAM (Evolutionary Pinout)

AS7C31024-20JC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP, DIP32,.3
针数:32Reach Compliance Code:unknown
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.41
风险等级:5.72Is Samacsys:N
最长访问时间:20 nsI/O 类型:COMMON
JESD-30 代码:R-PDIP-T32JESD-609代码:e0
内存密度:1048576 bit内存集成电路类型:STANDARD SRAM
内存宽度:8功能数量:1
端口数量:1端子数量:32
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX8
输出特性:3-STATE可输出:YES
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP32,.3封装形状:RECTANGULAR
封装形式:IN-LINE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:3.3 V
认证状态:Not Qualified最大待机电流:0.0005 A
最小待机电流:2 V子类别:SRAMs
最大压摆率:0.065 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

AS7C31024-20JC 数据手册

 浏览型号AS7C31024-20JC的Datasheet PDF文件第3页浏览型号AS7C31024-20JC的Datasheet PDF文件第4页浏览型号AS7C31024-20JC的Datasheet PDF文件第5页浏览型号AS7C31024-20JC的Datasheet PDF文件第7页浏览型号AS7C31024-20JC的Datasheet PDF文件第8页浏览型号AS7C31024-20JC的Datasheet PDF文件第9页 
AS7C1024  
AS7C31024  
®
Data retention characteristics (over the operating range)  
Parameter  
Symbol  
Test conditions  
Device  
Min  
2.0  
Max  
Unit  
V
V
CC for data retention  
VDR  
VCC = 2.0V  
AS7C1024  
5
mA  
mA  
ns  
Data retention current  
ICCDR  
CE1 VCC–0.2V or  
CE2 0.2V  
AS7C31024  
1
Chip deselect to data retention time  
Operation recovery time  
tCDR  
tR  
0
V VCC–0.2V or  
IN  
V 0.2V  
tRC  
ns  
IN  
Input leakage current  
| ILI |  
1
µA  
Data retention waveform  
Data retention mode  
V
V
V
2.0V  
V
CC  
CC  
CC  
DR  
t
t
R
CDR  
V
DR  
V
V
IH  
CE1  
IH  
AC test conditions  
– 5V output load: see Figure B or Figure C.  
– Input pulse level: GND to 3.0V. See Figure A.  
– Input rise and fall times: 2 ns. See Figure A.  
– Input and output timing reference levels: 1.5V.  
Thevenin equivalent:  
168W  
D
+1.728V (5V and 3.3V)  
OUT  
+5V  
+3.3V  
480W  
320W  
D
D
OUT  
OUT  
+3.0V  
90%  
10%  
90%  
10%  
255W  
C(14)  
GND  
255W  
C(14)  
GND  
2 ns  
Figure A: Input pulse  
GND  
Figure B: 5V Output load  
Figure C: 3.3V Output load  
Notes  
1
2
3
4
5
6
7
8
9
During V power-up, a pull-up resistor to V on CE1 is required to meet I specification.  
CC CC SB  
This parameter is sampled and not 100% tested.  
For test conditions, see AC Test Conditions, Figures A, B, and C.  
t
and t are specified with CL = 5pF, as in Figure C. Transition is measured ±500mV from steady-state voltage.  
CHZ  
CLZ  
This parameter is guaranteed, but not 100% tested.  
WEis High for read cycle.  
CE1 and OE are Low and CE2 is High for read cycle.  
Address valid prior to or coincident with CE1 transition Low.  
All read cycle timings are referenced from the last valid address to the first transitioning address.  
10 CE1 or WE must be High or CE2 Low during address transitions. Either CE1 or WE asserting high terminates a write cycle.  
11 All write cycle timings are referenced from the last valid address to the first transitioning address.  
12 CE1 and CE2 have identical timing.  
13 2V data retention applies to commercial temperature operating range only.  
14 C=30pF, except all high Z and low Z parameters, C=5pF.  
6
ALLIANCE SEMICONDUCTOR  
11/ 29/ 00  

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