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AS0A823-H4SB-7H PDF预览

AS0A823-H4SB-7H

更新时间： 2024-02-25 02:50:41
品牌 Logo 应用领域
富士康 - FOXCONN 连接器
页数 文件大小 规格书
5页 657K
描述
Card Edge Connector, 260 Contact(s), 1 Row(s), Female, Right Angle, Surface Mount Terminal, Socket

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AS0A823-H4SB-7H 技术参数

生命周期：ActiveReach Compliance Code：unknown
风险等级：5.75主体/外壳类型：SOCKET
连接器类型：CARD EDGE CONNECTOR触点性别：FEMALE
DIN 符合性：NO滤波功能：NO
IEC 符合性：NOMIL 符合性：NO
混合触点：NO安装方式：RIGHT ANGLE
安装类型：BOARD装载的行数：1
选件：GENERAL PURPOSE端子节距：0.5 mm
端接类型：SURFACE MOUNT触点总数：260
UL 易燃性代码：94V-0Base Number Matches：1

AS0A823-H4SB-7H 数据手册

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REV.  
A
ECN. NO.  
SOLIDWORKS GENERATED DRAWING, DO NOT CHANGE BY HAND  
APPD.  
C.S Li  
NOTES:  
BC-13-0071338  
1. ELECTRICAL CHARACTERISTICS:  
1.1. CONTACT CURRENT RATING: 0.5 AMPERE MAX. PER PIN.  
1.2. VOLTAGE RATING: 25V AC.  
C
OF CONNECTOR  
L
0.50  
0.15 ±0.02  
TYP.  
1.3. INSULATION RESISTANCE: 100 MEGAOHMS MIN. AT 500V DC.  
1.00 ±0.05  
1.4. DIELECTRIC WITHSTANDING VOLTAGE: 250V AC RMS AT 60Hz,FOR 1 MINUTE.  
1.5. CONTACT RESISTANCE: 30 MILLIOHMS MAX. PER PIN INITIAL  
10 MILLIOHMS PER PIN AFTER FULL ENVIRONMENTAL TESTING.  
2. MECHANICAL CHARACTERISTICS:DURABILITY: 60 MATING CYCLES.  
3. OPERATION TEMPERATURE: -55 C TO +85 C.  
TYP.  
A
B
C
D
E
A
B
C
D
E
0.90 ±0.05  
4. RECOMMENDED PROCESS CONDITION:SMT,PEAK TEMPERATURE:260 C 10~20S.  
5. PLEASE CONTACT FOXCONN SALES REPRESENTATIVE TO VERIFY PRODUCT DETAILS  
& AVAILABILITY.  
CONTACT  
2
METAL PAD  
3
HOUSING  
1
A
S
0 A8  
2
* - H 4 S B - 7  
H
H=HALOGEN/LEAD FREE  
7=TAPE REEL  
MEMORY MODULE  
SOCKET  
METAL SPRING  
4
1.9  
(2X)  
HORIZONTAL TYPE  
SINGLE ROW  
B=BLACK COLOR  
NO. OF POS.  
A8 = 260 POS.  
68.80 ±0.05  
S=STANDARD TYPE  
4=4.0mm HEIGHT  
3.50  
SMT  
DDR CONNECTOR  
CONTACT AREA PLATING  
7=15u" GOLD PLATING  
3= 30u" GOLD PLATING  
0.00  
0.94 -0.05  
72.1  
66.1  
(BETWEEN RAM TOP  
SURFACE AND SMT SURFACE)  
4.8 MAX.  
0.2 MIN.  
70.00 ±0.15 (SLOT WIDTH)  
65.7 ±0.5  
(BETWEEN RAM BOTTOM  
SURFACE AND SMT SURFACE)  
C
OF PAD  
L
35.50  
28.50  
1.375  
1.125  
PIN #144  
PIN #2  
PIN #260  
PIN #259  
PIN #146  
A
A
RAM MODULE  
CONNECTOR  
0.7  
0.7  
DDR4 STD  
PIN #1  
DATE CODE  
4.2  
4.2  
+0.05  
0.35 -0.10  
PIN #143  
1.375  
PIN #145  
1.125  
SECTION A-A  
4.0  
0.10  
35.50  
28.50  
260X CONTACT PLUS  
2X SOLDER PADS  
71.4  
73.1  
UNITS  
MAT'L  
mm  
X.  
X.  
.X  
±
±
0.30  
0.25  
±
±
NAME(INTENDED USE)  
DDR4 SO DIMM CONN.  
4
3
METAL SPRING  
METAL PAD  
2
2
STAINLESS STEEL  
STAINLESS STEEL  
ULTRASONIC CLEANING  
FOXCONN INTERCONNECT TECHNOLOGY LIMITED.  
.X  
.X  
10u" NICKEL UNDER PLATING  
100u" MATTE TIN PLATING OVER SOLDER PAD AREA  
TITLE:  
PART NO.(INTENDED USE)  
AS0A82*-H4SB-7H  
.XX ± 0.15  
.XX ±  
.XXX  
CUSTOMER DRAWING  
FINISH  
260PIN SODDR4 4.0 STD.  
50u" NICKEL UNDER PLATING  
±
±
.XXX  
2
CONTACT  
HOUSING  
260  
1
COPPER ALLOY  
GOLD FLASH PLATING AT TAIL  
APPD:  
DWG NO.:  
C.S. Li  
THESE DRAWINGS AND SPECIFICATIONS ARE  
THE PROPERTY OF FOXCONN INTERCONNECT  
TECHNOLOGY LIMITED.AND SHALL NOT BE  
REPRODUCED,COPIED OR USED IN ANY  
MANNER WITHOUT THE PRIOR WRITTEN  
CONSENT OF FOXCONN INTERCONNECT  
TECHNOLOGY LIMITED.  
15u" OR 30u" GOLD PLATING AT CONTACT AREA  
317-IN00-2260  
Q'TY  
CHKD:  
Alex Wang  
SCALE SHEET  
N/A 1/5  
REV.  
A
THERMOPLASTIC  
MATERIAL  
UL94V-0, HALOGEN FREE, BLACK COLOR  
TREATMENT  
1
DR:  
D.L Chen 10/9'13  
ITEM DESCRIPTION Q'TY  
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