Datasheet > AR2510

AR2510

更新时间： 2024-11-18 08:34:15

品牌	Logo	应用领域
DAESAN		二极管
页数	文件大小	规格书
2页	267K
描述
CURRENT 25.0 Amperes VOLTAGE 50 TO 1000 VOLTS

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数据手册

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AR2510 数据手册

CURRENT 25.0 Amperes

VOLTAGE 50 to 1000 Volts

AR2505 THRU AR2510

Features

· Plastic material used carries Underwriters Laboratory

Classification 94V-0

· Low cost construction utilizing void-free

molded plastic technique

· Low cost

0.185(4.7)

0.165(4.2)

0.250(6.4)

0.235(6.0)

· Diffused junctions

· Low leakage

· High surge capability

· High temperature soldering guaranteed :

250℃ for 10 seconds

Mechanical Data

0.410(10.4)

0.380(9.7)

0.225(5.7)

0.215(5.5)

· Case : AR molded plastic

· Terminals : Plated terminals, solderable per

MIL-STD-750, method 208

· Polarity : Color ring denotes cathode end

· Mounting Position : Any

· Weight : 0.07 ounce, 1.8 gram

Dimensions in inches and (millimeters)

Maximum Ratings And Electrical Characteristics

(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive

load. For capacitive load, derate by 20%)

2505

251

252

254

256

Symbols

Units

258 2510

Maximum recurrent peak reverse voltage

Maximum RMS voltage

RRM

RMS

100

200

140

200

400

280

400

600

420

600

800

560

800

1000

700

Volts

Maximum DC blocking voltage

100

1000

Maximum average forward rectified current

at TC=150℃

(AV)

25.0

400

1.0

Amps

Peak forward surge current 8.3ms half sine

wave superimposed on rated load

(JEDEC method) TJ=150℃

IFSM

Amps

Volts

μA

Maximum instantaneous forward voltage

at 25.0A

=25℃

5.0

250

3.0

Maximum DC reverse current

at rated DC blocking voltage

C=100℃

Typical reverse recovery time (Note 2)

Typical junction capacitance (Note 1)

Typical thermal resistance (Note 3)

trr

μS

=25℃

300

1.0

℃/W

RθJC

℃

Operating and storage temperature range

-50 to +175

TSTG

Notes:

(1) Measured at 1MHz and applied reverse voltage of 4.0V dc.

(2) Reverse recovery test conditions:I =0.5A, I =1.0A, Irr=0.25A

(3) Thermal resistance from junction to case, single side cooled.

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