Datasheet > APDS-9005

APDS-9005

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
安华高科 - AVAGO		传感器
页数	文件大小	规格书
12页	686K
描述
Miniature Surface-Mount Ambient Light Photo Sensor

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数据手册

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APDS-9005 数据手册

Recommended Reﬂow Proﬁle

MAX 260˚C

255

230

217

200

180

60 sec to 90 sec

Above 217˚C

150

120

100

150

200

250

COOL DOWN

300

t-TIME

(SECONDS)

HEAT

SOLDER

REFLOW

SOLDER PASTE DRY

Maximum DT/Dtime

Process Zone

Heat Up

Symbol

Pꢀ, Rꢀ

Pꢁ, Rꢁ

P3, R3

P3, R4

P4, R5

or Duration

ꢁ5°C to ꢀ50°C

ꢀ50°C to ꢁ00°C

ꢁ00°C to ꢁ55°C

ꢁ55°C to ꢁ00°C

ꢁ00°C to ꢁ5°C

> ꢁꢀꢂ°C

3°C/s

ꢀ00s to ꢀ80s

3°C/s

Solder Paste Dry

Solder Reﬂow

-6°C/s

Cool Down

-6°C/s

Time maintained above ꢁꢀꢂ°C

Peak Temperature

60s to 90s

ꢁ60°C

Time within 5°C of actual Peak Temperature

Time ꢁ5°C to Peak Temperature

> ꢁ55°C

ꢁ0s to 40s

8mins

ꢁ5°C to ꢁ60°C

Theꢀ reﬂowꢀ proﬁleꢀ isꢀ aꢀ straight-lineꢀ representationꢀ ofꢀ aꢀ nominalꢀ temperatureꢀ proﬁleꢀ forꢀ aꢀ convectiveꢀ reﬂowꢀ solderꢀ

process.ꢀTheꢀtemperatureꢀproﬁleꢀisꢀdividedꢀintoꢀfourꢀprocessꢀzones,ꢀeachꢀwithꢀdiﬀerentꢀDT/Dtimeꢀtemperatureꢀchangeꢀ

ratesꢀorꢀduration.ꢀTheꢀDT/Dtimeꢀratesꢀorꢀdurationꢀareꢀdetailedꢀinꢀtheꢀaboveꢀtable.ꢀꢀTheꢀtemperaturesꢀareꢀmeasuredꢀatꢀ

theꢀcomponentꢀtoꢀprintedꢀcircuitꢀboardꢀconnections.

Process zone P1,ꢀtheꢀPCꢀboardꢀandꢀAPDS-9005ꢀpinsꢀareꢀheatedꢀtoꢀaꢀtemperatureꢀofꢀ150°Cꢀtoꢀactivateꢀtheꢀﬂuxꢀinꢀtheꢀ

solderꢀpaste.ꢀTheꢀtemperatureꢀrampꢀupꢀrate,ꢀR1,ꢀisꢀlimitedꢀtoꢀ3°CꢀperꢀsecondꢀtoꢀallowꢀforꢀevenꢀheatingꢀofꢀbothꢀtheꢀPCꢀ

boardꢀandꢀAPDS-9005ꢀpins.

Process zone P2 shouldꢀbeꢀofꢀsuﬃcientꢀtimeꢀdurationꢀ(100ꢀtoꢀ180ꢀseconds)ꢀtoꢀdryꢀtheꢀsolderꢀpaste.ꢀTheꢀtemperatureꢀisꢀ

raisedꢀtoꢀaꢀlevelꢀjustꢀbelowꢀtheꢀliquidusꢀpointꢀofꢀtheꢀsolder,ꢀusuallyꢀ200°Cꢀ(392°F).ꢀ

Process zone P3 isꢀtheꢀsolderꢀreﬂowꢀzone.ꢀInꢀzoneꢀP3,ꢀtheꢀtemperatureꢀisꢀquicklyꢀraisedꢀaboveꢀtheꢀliquidusꢀpointꢀofꢀ

solderꢀtoꢀ255°Cꢀ(491°F)ꢀforꢀoptimumꢀresults.ꢀTheꢀdwellꢀtimeꢀaboveꢀtheꢀliquidusꢀpointꢀofꢀsolderꢀshouldꢀbeꢀbetweenꢀ20ꢀ

andꢀ40ꢀseconds.ꢀItꢀusuallyꢀtakesꢀaboutꢀ20ꢀsecondsꢀtoꢀassureꢀproperꢀcoalescingꢀofꢀtheꢀsolderꢀballsꢀintoꢀliquidꢀsolderꢀandꢀ

theꢀformationꢀofꢀgoodꢀsolderꢀconnections.ꢀBeyondꢀaꢀdwellꢀtimeꢀofꢀ40ꢀseconds,ꢀtheꢀintermetallicꢀgrowthꢀwithinꢀtheꢀ

solderꢀconnectionsꢀbecomesꢀexcessive,ꢀresultingꢀinꢀtheꢀformationꢀofꢀweakꢀandꢀunreliableꢀconnections.ꢀTheꢀtempera-

tureꢀisꢀthenꢀrapidlyꢀreducedꢀtoꢀaꢀpointꢀbelowꢀtheꢀsolidusꢀtemperatureꢀofꢀtheꢀsolder,ꢀusuallyꢀ200°Cꢀ(392°F),ꢀtoꢀallowꢀtheꢀ

solderꢀwithinꢀtheꢀconnectionsꢀtoꢀfreezeꢀsolid.ꢀ

Process zone P4 isꢀtheꢀcoolꢀdownꢀafterꢀsolderꢀfreeze.ꢀTheꢀcoolꢀdownꢀrate,ꢀR5,ꢀfromꢀtheꢀliquidusꢀpointꢀofꢀtheꢀsolderꢀtoꢀ

25°Cꢀ(77°F)ꢀshouldꢀnotꢀexceedꢀ6°Cꢀperꢀsecondꢀmaximum.ꢀThisꢀlimitationꢀisꢀnecessaryꢀtoꢀallowꢀtheꢀPCꢀboardꢀandꢀAPDS-

9005ꢀpinsꢀtoꢀchangeꢀdimensionsꢀevenly,ꢀputtingꢀminimalꢀstressesꢀonꢀtheꢀAPDS-9005.

Itꢀisꢀrecommendedꢀtoꢀperformꢀreﬂowꢀsolderingꢀnoꢀmoreꢀthanꢀtwice.

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与APDS-9005相关器件

型号	品牌	描述	获取价格	数据表
APDS-9005-020	AVAGO	Miniature Surface-Mount Ambient Light Photo Sensor	获取价格
APDS-9006-020	AVAGO	Miniature Surface-Mount Ambient Light Photo Sensor	获取价格
APDS-9007	AVAGO	Ambient Light Photo Sensor with Logarithmic Current Output	获取价格
APDS-9007-020	AVAGO	Ambient Light Photo Sensor with Logarithmic Current Output	获取价格
APDS-9008	AVAGO	Miniature Surface-Mount Ambient Light Photo Sensor	获取价格
APDS-9008_09	AVAGO	Miniature Surface-Mount Ambient Light Photo Sensor	获取价格

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