Datasheet > APDS-9005

APDS-9005

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
安华高科 - AVAGO		传感器
页数	文件大小	规格书
12页	686K
描述
Miniature Surface-Mount Ambient Light Photo Sensor

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APDS-9005 数据手册

1.2 Recommended Metal Solder Stencil Aperture

Appendix A: SMT Assembly Application Note

1.0 Solder Pad, Mask and Metal Stencil Aperture

Itꢀ isꢀ recommendedꢀ thatꢀ aꢀ 0.11ꢀ mmꢀ (0.004ꢀ inches)ꢀ thickꢀ

stencilꢀ beꢀ usedꢀ forꢀ solderꢀ pasteꢀ printing.ꢀ Apertureꢀ

openingꢀforꢀshieldꢀpadꢀisꢀ0.4mmꢀxꢀ0.4mmꢀandꢀ0.2mmꢀxꢀ

0.4mmꢀ(asꢀperꢀlandꢀpattern).ꢀThisꢀisꢀtoꢀensureꢀadequateꢀ

printedꢀsolderꢀpasteꢀvolumeꢀandꢀnoꢀshorting.

Metal Stencil For

Solder Paste

Printing

Stencil

Aperture

Opening

Land

Pattern

0.11

Solder

Mask

1.6

PCBA

1.7

Unit: mm

Figure A3. Solder Stencil Aperture

1.3 Adjacent Land Keepout and Solder Mask Areas

Adjacentꢀlandꢀkeep-outꢀisꢀtheꢀmaximumꢀspaceꢀoccupiedꢀ

byꢀtheꢀunitꢀrelativeꢀtoꢀtheꢀlandꢀpattern.ꢀThereꢀshouldꢀbeꢀ

noꢀotherꢀSMDꢀcomponentsꢀwithinꢀthisꢀarea.

Figure A1. Stencil and PCBA

1.1 Recommended Land Pattern

0.4

0.3

Theꢀminimumꢀsolderꢀresistꢀstripꢀwidthꢀrequiredꢀtoꢀavoidꢀ

solderꢀbridgingꢀadjacentꢀpadsꢀisꢀ0.2ꢀmm.

Note:ꢀWet/LiquidꢀPhoto-Imageableꢀsolderꢀresist/maskꢀisꢀrecommended.

2.6

0.45

0.9

0.4

Mounting

2.7

Center

Unit: mm

0.2

0.4

0.2 MIN.

Figure A2. Recommended Land Pattern

Figure A4 Adjacent Land Keepout and Solder Mask Areas

ꢀ0

1...7 8 91011 12

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