AP22913
Absolute Maximum Ratings (@ TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD CDM
VIN
Parameter
Human Body Model ESD Protection
Ratings
6
Unit
kV
kV
V
Charged Device Model ESD Protection
Input Voltage
2
-0.3 to 6
-0.3 to 6
-0.3 to 6
2
Output Voltage
V
VOUT
ON Voltage
V
VON
Maximum Continuous Load Current
Maximum Pulse Load Current, Pulse <300µs, 2% Duty Cycle
Maximum Junction Temperature
Storage Temperature Range
A
ILOAD
2.5
A
ILOAD
+125
°C
°C
TJ
-65 to +150
TST
WLB0909-4
930
Power Dissipation
mW
°C/W
°C/W
PD
SOT-26
WLB0909-4
SOT-26
760
136
Thermal Resistance, Junction to Ambient (Note 4)
Thermal Resistance, Junction to Case (Note 5)
RθJA
165
31
WLB0909-4
SOT-26
RθJC
30
Notes:
4. The JEDEC high-K (2s2p) board used to derive this data was a 3 inch x 3 inch, multilayer board with 1oz internal power and ground planes with2oz
copper traces on top and bottom of the board.
5. Thermal resistance from junction to case.
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Recommended Operating Conditions (@ TA = +25°C, unless otherwise specified.)
Symbol
VIN
Parameter
Min
1.4
0
Max
5.5
5.5
5.5
2.0
5.5
0.6
0.4
+85
Unit
V
Input Voltage
ON Voltage Range
Output Voltage
Output Current
V
VON
1.4
0
V
VOUT
IOUT
A
ON High-Level Input Voltage
1.1
0
V
VIH
V
VIN = 3.6V to 5.5V
VIN = 1.4V to 3.6V
ON Low-Level Input
Voltage
VIL
TA
0
V
Operating Ambient Temperature
-40
°C
3 of 17
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May 2021
© Diodes Incorporated
AP22913
Document number: DS41203 Rev. 6 - 2