AP1201
Single-Channel Power Distribution Switch
ꢀ Function Description
Thermal Shutdown
Error Flag
When the chip temperature exceeds 140ºC for any
reason, the thermal shutdown function enables and
turns off MOSFET’s switch and signals the error
flag. A hysteresis of 10ºC prevents the MOSFETs
from turning back on until the chip temperature
drops to below 130ºC.
An open-drained output of an N-channel MOSFET,
the FLG output is pulled low to signal the following
fault conditions: input under-voltage, output current
limit, and thermal shutdown.
Current Limit
The current limit is set externally. It protects the
output MOSFET switches from damage due to
undesirable short circuit conditions or excess inrush
current often encountered during hot plug-in. The
low limit of the current limit threshold of the AP1201
allows a minimum current of 0.9A through the
MOSFET switches. A current limit condition will
signal the error flag. A resistor from SET to VIN
sets the current-Limit value.
Supply Filtering
A 0.1µF to 1µF bypass capacitor from IN to GND,
located near the device, is strongly recommended
to control supply transients. Without a bypass
capacitor, an output short may cause sufficient
ringing on the input (from supply lead inductance)
to damage internal control circuitry.
Transient Droop Requirements
USB supports dynamic attachment (hot plug-in) of
peripherals. A current surge is caused by the input
capacitance of downstream device. Ferrite beads
are recommended in series with all power and
ground connector pins. Ferrite beads reduce EMI
and limit the inrush current during hot-attachment
by filtering high-frequency signals.
ILIM(MAX) ~ 1.4X ILIM(TYP)
ILIM(MIN) ~ 0.8X ILIM(TYP)
AP1201 Rset
Current Limit Threshold (A)
RSET (Ω)
Typical value
Short Circuit Transient
(Vout = 5V)
(Vout = 3.3V)
0.69
Bulk capacitance provides the short-term transient
current needed during a hot-attachment event. With
a 33µF, 16V tantalum or 100µF, 10V electrolytic
capacitor mounted close to downstream connector
per port should provide transient drop protection.
10K
20K
0.71
0.92
1.01
1.05
1.10
1.15
1.19
1.22
1.25
0.90
30K
1.00
40K
1.02
60K
1.08
80K
1.11
Printed Circuit Layout
100K
200K
floating
1.16
The power circuitry of USB printed circuit boards
requires a customized layout to maximize thermal
dissipation and to minimize voltage drop and EMI.
1.20
1.23
Anachip Corp.
www.anachip.com.tw
Rev.0.4 Jan 28, 2004
5/9