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AND5610

更新时间: 2024-12-01 06:37:15
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LED Displays

AND5610 数据手册

 浏览型号AND5610的Datasheet PDF文件第2页 
O
PTOELECTRONICS  
LED Displays  
Unit: mm  
Product specifications contained herein may be changed without prior  
notice. It is therefore advisable to contact Purdy Electronics before  
proceeding with the design of equipment incorporating this product.  
8°  
8.13  
1.4  
8.0  
0.5 Dia.  
AND-5610 Series  
GaAsP/GaP–Red; GaP–Green  
7 Segment, 0.56 Inch  
10  
6
A
F
B
G
E
C
DP  
5
1 D  
12.4  
1.68 Dia.  
3.5 Min.  
Features  
RoHS Compliant  
• 0.56 inch character height  
• Available in red or green  
• Suitable for numerical readout for instrument and  
industrial products  
• Industry pin-for-pin compatibility  
2.54 x 4 = 10.16  
• Available in both common cathode and common anode  
Description  
Common  
Color  
Number  
of Digits  
Number  
of Pins  
Size  
Cathode  
Anode  
Display  
Face  
0.56 inch  
0.56 inch  
1
1
AND-5610SCL  
AND-5610GCL  
AND-5610SAL  
AND-5610GAL  
Red  
Red  
10  
10  
Green  
Gray  
Absolute Maximum Ratings (T = 25°C)  
Characteristics  
Symbol  
Rating  
30  
Unit  
I (DC)/SEG  
mA  
mA  
V
DC Forward Current/Segment  
Pulse Forward Current/Segment  
Reverse Voltage/Segment  
Operating Temperature Range  
Storage Temperature Range  
F
I
/SEG  
100  
FP  
V
3 (Red), 5 (Green)  
-25 to 85  
R
T
°C  
°C  
Opr  
T
-25 to 100  
Stg  
Electro-Optical Characteristics (T = 25°C)  
Characteristics  
Forward Voltage  
Reverse Current  
Symbol  
Test Condition  
Minimum  
Typical  
2.1  
Maximum  
Unit  
V
V
I = 10 mA  
3.0  
100  
F
F
I
V
= 3 (Red), 5 (Green)  
µA  
R
R
I
I = 10 mA  
2.0  
1.7  
3.3  
mcd  
mcd  
nm  
nm  
nm  
nm  
Red  
Green  
Red  
Green  
Red  
Green  
V
F
Luminous Intensity  
Per Segment  
I
I = 10 mA  
2.9  
V
F
λ
I = 10 mA  
635  
567  
40  
P
F
Peak Emission  
Wavelength  
λ
I = 10 mA  
P
F
I = 10 mA  
∆λ  
∆λ  
F
Spectral Line  
Half Width  
I = 10 mA  
30  
F
Precaution  
Please be careful of the following:  
1. Soldering temperature: 260°C max; Soldering time: 3 sec. max; Soldering portion of lead: up to 2 mm from the body of the device.  
2. The lead can be formed up to 5 mm from the body of the device without forming stress. Soldering should be performed after the lead  
forming.  
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085  
Tel:408.523.8200 • Fax:408.733.1287 • email@purdyelectronics.com • www.purdyelectronics.com  
7/18/07  

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