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AND180AYP

更新时间： 2024-11-24 06:37:15
品牌 Logo 应用领域
PURDY /
页数 文件大小 规格书
2页 55K
描述
InGaAlP Yellow Light Emission

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中文翻译

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AND180AYP 技术参数

生命周期：Contact ManufacturerReach Compliance Code：unknown
风险等级：5.71颜色@波长：Yellow
最大正向电流：0.05 A最大正向电压：2.4 V
透镜类型：CLEAR最高工作温度：85 °C
最低工作温度：-40 °C总高度：9.7 mm
峰值波长：590 nm最大反向电压：4 V
子类别：Visible LEDs视角：8 deg
Base Number Matches：1

AND180AYP 数据手册

 浏览型号AND180AYP的Datasheet PDF文件第2页 
AND180AYP  
Ultra Bright LED Lamps: Type 2  
Weight: 0.31 g  
Unit: mm  
AND180AYP  
InGaAlP Yellow Light Emission  
T-1 3/4 Package (5 mm)  
5.0 0.2  
Features  
• New emission material (InGaAlP) yellow LED  
• Peak wavelength (lp = 590 nm) high bright emission  
• All plastic mold type, clear colorless lens  
• Low drive current, (forward current = 1 to 20 mA)  
• Excellent On-Off contrast ratio  
• Fast response time, capable of pulse operation  
• High power luminous intensity  
• Suitable for Outdoor Message Signboards  
• RoHS Compliant  
0.5  
Maximum Ratings (Ta = 25°C)  
Characteristics  
Symbol  
Rating  
50  
Unit  
mA  
V
2.54  
I
Forward Current  
F
Cathode Index  
V
5
Reverse Voltage  
R
P
125  
mW  
°C  
Power Dissipation  
D
1
2
T
-40 to 85  
-40 to 100  
Operating Temperature Range  
Storage Temperature Range  
Opr  
1. Anode  
2. Cathode  
T
°C  
Sig  
Electro-Optical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Minimum  
Typical  
Maximum  
Unit  
V
V
I = 20 mA  
–
2.1  
–
2.8  
10  
–
Forward Voltage  
F
F
I
V = 4 V  
R
–
µA  
Reverse Current  
R
I
I = 20 mA  
1,600  
2,500  
590  
15  
mcd  
nm  
Luminous Intensity  
Peak Emission Wavelength  
Spectral Line Half Width  
Dominant Wavelength  
Full Viewing Angle  
V
F
l
I = 20 mA  
–
–
–
–
–
P
F
I = 20 mA  
∆l  
ld  
q
–
nm  
F
I = 20 mA  
591  
10  
–
nm  
F
I
= 1/2 Peak  
–
degree  
V
Precaution  
Please be careful of the following:  
1. Soldering temperature: 260°C max  
Soldering time: 5 sec. max  
Soldering portion of lead: up to 1.6 mm from the body of the device  
2. The lead can be formed up to 5 mm from the body of the device without forming stress.  
Soldering should be performed after the lead forming.  
Product specifications contained herein may be changed without prior notice.  
It is therefore advisable to contact Purdy Electronics before proceeding with the design of equipment incorporating this product.  
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085  
Tel:408.523.8200 • Fax:408.733.1287 • sales@purdyelectronics.com • www.purdyelectronics.com  
7/18/07  
12

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