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AMIS30521C5212RG PDF预览

AMIS30521C5212RG

更新时间： 2024-01-25 06:49:29
品牌 Logo 应用领域
安森美 - ONSEMI 驱动器运动控制电子器件信号电路电动机控制电机
页数 文件大小 规格书
28页 281K
描述
Micro-Stepping Motor Driver

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AMIS30521C5212RG 技术参数

是否无铅：不含铅生命周期：Active
零件包装代码：QFN包装说明：HVQCCN, LCC32,.27SQ,25
针数：32Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
Factory Lead Time：21 weeks风险等级：5.14
Is Samacsys：N其他特性：ALSO NEEDS 4.5V TO 5.25V VDD SUPPLY
模拟集成电路 - 其他类型：STEPPER MOTOR CONTROLLERJESD-30 代码：S-XQCC-N32
JESD-609代码：e3长度：7 mm
湿度敏感等级：3功能数量：1
端子数量：32最高工作温度：125 °C
最低工作温度：-40 °C最大输出电流：1.6 A
封装主体材料：UNSPECIFIED封装代码：HVQCCN
封装等效代码：LCC32,.27SQ,25封装形状：SQUARE
封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度（摄氏度）：NOT SPECIFIED
电源：5,6/30 V认证状态：Not Qualified
座面最大高度：0.9 mm子类别：Motion Control Electronics
最大供电电压 (Vsup)：30 V最小供电电压 (Vsup)：6 V
标称供电电压 (Vsup)：12 V表面贴装：YES
温度等级：AUTOMOTIVE端子面层：Tin (Sn)
端子形式：NO LEAD端子节距：0.65 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：7 mmBase Number Matches：1

AMIS30521C5212RG 数据手册

 浏览型号AMIS30521C5212RG的Datasheet PDF文件第2页浏览型号AMIS30521C5212RG的Datasheet PDF文件第3页浏览型号AMIS30521C5212RG的Datasheet PDF文件第4页浏览型号AMIS30521C5212RG的Datasheet PDF文件第6页浏览型号AMIS30521C5212RG的Datasheet PDF文件第7页浏览型号AMIS30521C5212RG的Datasheet PDF文件第8页 
AMIS−30521, NCV70521  
PACKAGE THERMAL CHARACTERISTICS  
The AMIS−30521/NCV70521 is available in an  
The R for 2S2P is simulated conform JEDEC JESD−51  
thja  
NQFP−32 package. For cooling optimizations, the NQFP  
has an exposed thermal pad which has to be soldered to the  
PCB ground plane. The ground plane needs thermal vias to  
conduct the heat to the bottom layer. Figure 3 gives an  
example for good power distribution solutions.  
For precise thermal cooling calculations the major  
thermal resistances of the device are given. The thermal  
media to which the power of the devices has to be given are:  
• Static environmental air (via the case)  
• PCB board copper area (via the exposed pad)  
The thermal resistances are presented in Table 5: DC  
Parameters.  
as follows:  
• A 4−layer printed circuit board with inner power planes  
and outer (top and bottom) signal layers is used  
• Board thickness is 1.46 mm (FR4 PCB material)  
• The 2 signal layers: 70 mm thick copper with an area of  
2
5500 mm copper and 20% conductivity  
• The 2 power internal planes: 36 mm thick copper with  
2
an area of 5500 mm copper and 90% conductivity  
The R for 1S0P is simulated conform JEDEC JESD−51  
thja  
as follows:  
• A 1−layer printed circuit board with only 1 layer  
• Board thickness is 1.46 mm (FR4 PCB material)  
• The layer has a thickness of 70 mm copper with an area  
The major thermal resistances of the device are the Rth  
from the junction to the ambient (R ) and the overall Rth  
thja  
2
from the junction to exposed pad (R ). In Table 3 one can  
thjp  
of 5500 mm copper and 20% conductivity  
find the values for the R  
simulated according to  
thja  
JESD−51.  
NQFP−32  
Figure 3. Example of NQFP−32 PCB Ground Plane Layout in Top View (Preferred Layout at Top and Bottom)  
ELECTRICAL SPECIFICATION  
Recommended Operation Conditions  
ranges is not guaranteed. Operating outside the  
recommended operating ranges for extended periods of time  
may affect device reliability.  
Operating ranges define the limits for functional  
operation and parametric characteristics of the device. Note  
that the functionality of the chip outside these operating  
Table 4. OPERATING RANGES  
Symbol  
Parameter  
Min  
+6  
Max  
+30  
Unit  
V
V
Analog DC supply  
BB  
DD  
V
Logic supply voltage  
Junction temperature  
4.75  
−40  
5.25  
V
T
+172 (Note 5)  
°C  
J
5. No more than 100 cumulative hours in life time above T  
tw  
http://onsemi.com  
5
 
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