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AMIS-720639

更新时间： 2024-11-30 03:18:43

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AMIS-720639 技术参数

生命周期：	Transferred	Reach Compliance Code：	unknown
风险等级：	5.76	Base Number Matches：	1

AMIS-720639: 600dpi CIS Sensor Chip

Data Sheet

1.0 Description

AMI Semiconductor’s AMIS-720639 (PI3039) contact image sensor (CIS) sensor chip is a linear array image sensor chip with a 600

elements per inch resolution. The sensor chip is fabricated with AMI Semiconductor’s proprietary CMOS image sensing technology.

Since this image sensor chip is intended for CIS module applications, multiple numbers of these sensors will be serially cascaded to

form a linear scanning image array of arbitrary length. These sensors are butted end-to-end on a printed circuit board (PCB). The

sensors are mounted using the chip-on-board technology to form scanning arrays with various lengths.

Figure 1: AMIS-720639 Sensor Block Diagram

Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 192 detector elements, their associated multiplexing

switches, buffer amplifiers and a chip selector. The detector's element-to-element spacing is approximately 42µm. The size of each

chip without the scribe lines is 8080µm by 360µm and each sensor chip has six bonding pads. The pad symbols and functions are

described in Table 1.

Table 1: Pad Symbols and Functions

Symbol

Function

Start pulse: input to start the line scan

Clock pulse: input to clock the shift register

Positive supply: +5V supply connected to substrate

VSS is tied to ground: connection topside common

Video signal current output from a source follower

End-of-scan pulse: output from the shift register at end-of-scan

VDD

VSS

IOUT

EOS

AMI Semiconductor – May 06, M-20569-001

www.amis.com

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