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AMIS-30621-UNA PDF预览

AMIS-30621-UNA

更新时间: 2024-01-30 09:18:16
品牌 Logo 应用领域
AMI 电动机控制
页数 文件大小 规格书
57页 1017K
描述
Stepper Motor Controller, 0.8A, 7 X 7 MM, NQFP-32

AMIS-30621-UNA 技术参数

生命周期:Transferred零件包装代码:QFP
包装说明:7 X 7 MM, NQFP-32针数:32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.5
模拟集成电路 - 其他类型:STEPPER MOTOR CONTROLLERJESD-30 代码:S-XQCC-N32
长度:7 mm功能数量:1
端子数量:32最高工作温度:125 °C
最低工作温度:-40 °C最大输出电流:0.8 A
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
认证状态:Not Qualified座面最大高度:0.9 mm
最大供电电压 (Vsup):29 V最小供电电压 (Vsup):8 V
标称供电电压 (Vsup):12 V表面贴装:YES
温度等级:AUTOMOTIVE端子形式:NO LEAD
端子节距:0.65 mm端子位置:QUAD
宽度:7 mm

AMIS-30621-UNA 数据手册

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AMIS-30621 LIN Micro-stepping Motor Driver  
Data Sheet  
19.0 Soldering  
19.1 Introduction to Soldering Surface Mount Packages  
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data  
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for  
all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards (PCBs) with  
high population densities. In these situations re-flow soldering is often used.  
19.2 Re-flow Soldering  
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by  
screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for  
example, infrared/convection heating in a conveyor type oven.  
Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical re-  
flow peak temperatures range from 215 to 260°C. The top-surface temperature of the packages should preferably be kept below 230°C.  
19.3 Wave Soldering  
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as  
solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was  
specifically developed.  
If wave soldering is used the following conditions must be observed for optimal results:  
Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.  
For packages with leads on two sides and a pitch (e):  
o
o
o
Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of  
the PCB;  
Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The  
footprint must incorporate solder thieves at the downstream end.  
For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the  
PCB. The footprint must incorporate solder thieves downstream and at the side corners.  
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen  
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds  
at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.  
19.4 Manual Soldering  
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat  
part of the lead. Contact time must be limited to 10 seconds at up to 300°C.  
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.  
AMI Semiconductor – Sept. 2007, Rev 1.5  
56  
www.amis.com  

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