AMIS-30621 LIN Micro-stepping Motor Driver
Data Sheet
Table 29: Soldering Process
Soldering Method
Package
Wave
Re-flow (1)
Suitable
Suitable
Suitable
Suitable
Suitable
BGA, SQFP
Not suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC (3) , SO, SOJ
Not suitable (2)
Suitable
LQFP, QFP, TQFP
Not recommended (3)(4)
Not recommended (5)
SSOP, TSSOP, VSO
Notes:
(1) All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the
package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to
the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
(2) These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder
may stick to the heatsink (on top version).
(3) If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves
downstream and at the side corners.
(4) Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e)
equal to or smaller than 0.65mm.
(5) Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e)
equal to or smaller than 0.5mm.
20.0 Company or Product Inquiries
For more information about AMI Semiconductor’s products or services visit our Web site at: http://www.amis.com.
21.0 Document History
Table 30: Document history
Version
1.4
Date of Version
March 3, 2003
Modifications/Additions
First non-preliminary version for public release
1.5
September 6, 2007
Various cosmetic changes, addition of detailed feature descriptions and U-product options.
Production Technical Data - The information contained in this document applies to a product in production. AMI Semiconductor and its subsidiaries (“AMIS”) have made every effort to ensure
that the information is accurate and reliable. However, the characteristics and specifications of the product are subject to change without notice and the information is provided “AS IS” without
warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify that data being relied on is the most current and complete. AMIS
reserves the right to discontinue production and change specifications and prices at any time and without notice. Products sold by AMIS are covered by the warranty and patent
indemnification provisions appearing in its Terms of Sale only. AMIS makes no other warranty, express or implied, and disclaims the warranties of noninfringement, merchantability, or fitness
for a particular purpose. AMI Semiconductor's products are intended for use in ordinary commercial applications. These products are not designed, authorized, or warranted to be suitable for
use in life-support systems or other critical applications where malfunction may cause personal injury. Inclusion of AMIS products in such applications is understood to be fully at the
customer’s risk. Applications requiring extended temperature range, operation in unusual environmental conditions, or high reliability, such as military or medical life-support, are specifically
not recommended without additional processing by AMIS for such applications. Copyright © 2007 AMI Semiconductor, Inc.
AMI Semiconductor – Sept. 2007, Rev 1.5
57
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