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AM29F010B-120DTE1 PDF预览

AM29F010B-120DTE1

更新时间: 2024-11-02 21:21:31
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路
页数 文件大小 规格书
12页 324K
描述
Flash, 128KX8, 120ns, DIE-30

AM29F010B-120DTE1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIE包装说明:DIE-30
针数:30Reach Compliance Code:compliant
ECCN代码:3A001.A.2.CHTS代码:8542.32.00.51
风险等级:5.41最长访问时间:120 ns
JESD-30 代码:R-XUUC-N30JESD-609代码:e0
内存密度:1048576 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
端子数量:30字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:128KX8封装主体材料:UNSPECIFIED
封装代码:DIE封装形状:RECTANGULAR
封装形式:UNCASED CHIP并行/串行:PARALLEL
峰值回流温度(摄氏度):240编程电压:5 V
认证状态:Not Qualified最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:TIN LEAD
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:30类型:NOR TYPE
Base Number Matches:1

AM29F010B-120DTE1 数据手册

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Am29F010B Known Good Die  
Data Sheet (Retired Product)  
Am29F010B Known Good Die Cover Sheet  
This product has been retired and is not recommended for designs. Please contact your Spansion representative for  
alternates. Availability of this document is retained for reference and historical purposes only.  
The following document contains information on Spansion memory products.  
Continuity of Specifications  
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been  
made are the result of normal data sheet improvement and are noted in the document revision summary.  
For More Information  
Please contact your local sales office for additional information about Spansion memory solutions.  
Publication Number 23479  
Revision A  
Amendment 3  
Issue Date March 2, 2009  

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