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AM29DL642G90I PDF预览

AM29DL642G90I

更新时间: 2024-02-19 04:16:34
品牌 Logo 应用领域
超微 - AMD /
页数 文件大小 规格书
54页 832K
描述
128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only Simultaneous Read/Write Flash Memo

AM29DL642G90I 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:10.95 X 11.95 MM, 0.80 MM PITCH, PLASTIC, FBGA-63
针数:63Reach Compliance Code:not_compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.81最长访问时间:90 ns
启动块:BOTTOM/TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B63JESD-609代码:e0
长度:11.95 mm内存密度:134217728 bit
内存集成电路类型:FLASH MODULE内存宽度:16
湿度敏感等级:3功能数量:1
部门数/规模:16,126端子数量:63
字数:8388608 words字数代码:8000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:8MX16
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA63,8X12,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):240电源:3/3.3 V
编程电压:3.3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.4 mm
部门规模:4K,32K最大待机电流:0.00001 A
子类别:Flash Memories最大压摆率:0.045 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30切换位:YES
类型:NOR TYPE宽度:10.95 mm

AM29DL642G90I 数据手册

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P R E L I M I N A R Y  
GENERAL DESCRIPTION  
The Am29DL642G is a 128 Mbit, 3.0 Volt (2.7 V to 3.6 V)  
that combines two Am29DL640G single power supply  
flash memory devices in a single 63-ball Fortified BGA  
package. Each Am29DL640G is a 64 Mbit, 3.0 Volt (2.7 V  
to 3.6 V) device organized as 4,194,304 words. Data ap-  
pears on DQ15-DQ0. The device is designed to be pro-  
grammed in-system with the standard system 3.0 volt  
VCC supply. A 12.0 volt VPP is not required for program or  
erase operations. The Am29DL642G is equipped with  
two CE# inputs for flexible selection between the two in-  
ternal 64 Mb devices. The device can also be pro-  
grammed in standard EPROM programmers.  
nently set to a 1 if the part is factory locked, and set to a  
0 if customer lockable. This way, customer lockable  
parts can never be used to replace a factory locked part.  
Factory locked parts provide several options. The SecSi  
Sector may store a secure, random 16 byte ESN (Elec-  
tronic Serial Number), customer code (programmed  
through AMD’s ExpressFlash service), or both. Customer  
Lockable parts may utilize the SecSi Sector as bonus  
space, reading and writing like any other flash sector, or  
may permanently lock their own code there.  
DMS (Data Management Software) allows systems to  
easily take advantage of the advanced architecture of the  
simultaneous read/write product line by allowing removal  
of EEPROM devices. DMS will also allow the system soft-  
ware to be simplified, as it will perform all functions nec-  
essary to modify data in file structures, as opposed to  
single-byte modifications. To write or update a particular  
piece of data (a phone number or configuration data, for  
example), the user only needs to state which piece of  
data is to be updated, and where the updated data is lo-  
cated in the system. This is an advantage compared to  
systems where user-written software must keep track of  
the old data location, status, logical to physical translation  
of the data onto the Flash memory device (or memory  
devices), and more. Using DMS, user-written software  
does not need to interface with the Flash memory di-  
rectly. Instead, the user's software accesses the Flash  
memory by calling one of only six functions. AMD pro-  
vides this software to simplify system design and soft-  
ware integration efforts.  
The Am29DL642G offers an access time of 70 or 90 ns.  
To eliminate bus contention the Am29DL642G device has  
two separate chip enables (CE# and CE2#). Each chip  
enable (CE# or CE2#) is connected to only one of the two  
dice in the Am29DL642G package. To the system, this  
device will be the same as two independent  
Am29DL640G on the same board. The only difference  
is that they are now packaged together to reduce  
board space.  
Each device requires only a single 3.0 Volt power sup-  
ply (2.7 V to 3.6 V) for both read and write functions. In-  
ternally generated and regulated voltages are provided  
for the program and erase operations.  
Simultaneous Read/Write Operations with  
Zero Latency  
The Simultaneous Read/Write architecture provides si-  
multaneous operation by dividing the memory space of  
each Am29DL640G device into four banks, two 8 Mb  
banks with small and large sectors, and two 24 Mb banks  
of large sectors. Sector addresses are fixed, system soft-  
ware can be used to form user-defined bank groups.  
The device offers complete compatibility with the JEDEC  
single-power-supply Flash command set standard.  
Commands are written to the command register using  
standard microprocessor write timings. Reading data out  
of the device is similar to reading from other Flash or  
EPROM devices.  
During an Erase/Program operation, any of the three  
non-busy banks may be read from. Note that only two  
banks can operate simultaneously. The device can im-  
prove overall system performance by allowing a host sys-  
tem to program or erase in one bank, then immediately  
and simultaneously read from the other bank, with zero  
latency. This releases the system from waiting for the  
completion of program or erase operations.  
The host system can detect whether a program or erase  
operation is complete by using the device status bits:  
RY/BY# pin, DQ7 (Data# Polling) and DQ6/DQ2 (toggle  
bits). After a program or erase cycle has been completed,  
the device automatically returns to the read mode.  
The sector erase architecture allows memory sectors to  
be erased and reprogrammed without affecting the data  
contents of other sectors. The device is fully erased when  
shipped from the factory.  
Each Am29DL640G can be organized as both a top and  
bottom boot sector configuration.  
Bank  
Megabits  
Sector Sizes  
Eight 4 Kword,  
Fifteen 32 Kword  
Hardware data protection measures include a low VCC  
detector that automatically inhibits write operations dur-  
ing power transitions. The hardware sector protection  
feature disables both program and erase operations in  
any combination of the sectors of memory. This can be  
achieved in-system or via programming equipment.  
Bank 1  
8 Mb  
Bank 2  
Bank 3  
24 Mb  
24 Mb  
Forty-eight 32 Kword  
Forty-eight 32 Kword  
Eight 4 Kword,  
Fifteen 32 Kword  
Bank 4  
8 Mb  
The device offers two power-saving features. When ad-  
dresses have been stable for a specified amount of time,  
the device enters the automatic sleep mode. The sys-  
tem can also place the device into the standby mode.  
Power consumption is greatly reduced in both modes.  
Am29DL642G Features  
The SecSi™ (Secured Silicon) Sector is an extra 256  
byte sector capable of being permanently locked by AMD  
or customers. The SecSi Indicator Bit (DQ7) is perma-  
2
Am29DL642G  
June 10, 2005  

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