P R E L I M I N A R Y
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Special Handling Instructions for BGA Packages ..................... 6
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Am29DL640G Device Bus Operations ................................9
Word/Byte Configuration .......................................................... 9
Requirements for Reading Array Data .....................................9
Writing Commands/Command Sequences ............................ 10
Accelerated Program Operation ............................................. 10
Autoselect Functions .............................................................. 10
Simultaneous Read/Write Operations with Zero Latency ....... 10
Standby Mode ........................................................................ 10
Automatic Sleep Mode ........................................................... 11
RESET#: Hardware Reset Pin ............................................... 11
Output Disable Mode .............................................................. 11
Table 2. Am29DL640G Sector Architecture ....................................11
Table 3. Bank Address ....................................................................14
Table 4. SecSiTM Sector Addresses ................................................14
Autoselect Mode..................................................................... 14
Table 5. Am29DL640G Autoselect Codes, (High Voltage Method) 15
Sector/Sector Block Protection and Unprotection .................. 16
Table 6. Am29DL640G Boot Sector/Sector Block Addresses for
Protection/Unprotection ...................................................................16
Write Protect (WP#) ................................................................ 17
Table 7. WP#/ACC Modes ..............................................................17
Temporary Sector Unprotect .................................................. 17
Figure 1. Temporary Sector Unprotect Operation........................... 17
Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 18
SecSi™ (Secured Silicon) Sector
Erase Suspend/Erase Resume Commands ...........................26
Figure 4. Erase Operation.............................................................. 26
Table 12. Am29DL640G Command Definitions............................. 27
Write Operation Status. . . . . . . . . . . . . . . . . . . . . 28
DQ7: Data# Polling ................................................................. 28
Figure 5. Data# Polling Algorithm .................................................. 28
RY/BY#: Ready/Busy#............................................................ 29
DQ6: Toggle Bit I .................................................................... 29
Figure 6. Toggle Bit Algorithm........................................................ 29
DQ2: Toggle Bit II ................................................................... 30
Reading Toggle Bits DQ6/DQ2 ............................................... 30
DQ5: Exceeded Timing Limits ................................................ 30
DQ3: Sector Erase Timer .......................................................30
Table 13. Write Operation Status ................................................... 31
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 32
Figure 7. Maximum Negative Overshoot Waveform ...................... 32
Figure 8. Maximum Positive Overshoot Waveform........................ 32
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 9. ICC1 Current vs. Time (Showing Active and
Automatic Sleep Currents)............................................................. 34
Figure 10. Typical ICC1 vs. Frequency............................................ 34
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 11. Test Setup.................................................................... 35
Figure 12. Input Waveforms and Measurement Levels ................. 35
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 36
Read-Only Operations ........................................................... 36
Figure 13. Read Operation Timings............................................... 36
Hardware Reset (RESET#) .................................................... 37
Figure 14. Reset Timings............................................................... 37
Word/Byte Configuration (BYTE#) ..........................................38
Figure 15. BYTE# Timings for Read Operations............................ 38
Figure 16. BYTE# Timings for Write Operations............................ 38
Erase and Program Operations .............................................. 39
Figure 17. Program Operation Timings.......................................... 40
Figure 18. Accelerated Program Timing Diagram.......................... 40
Figure 19. Chip/Sector Erase Operation Timings .......................... 41
Figure 20. Back-to-back Read/Write Cycle Timings ...................... 42
Figure 21. Data# Polling Timings (During Embedded Algorithms). 42
Figure 22. Toggle Bit Timings (During Embedded Algorithms)...... 43
Figure 23. DQ2 vs. DQ6................................................................. 43
Temporary Sector Unprotect .................................................. 44
Figure 24. Temporary Sector Unprotect Timing Diagram .............. 44
Figure 25. Sector/Sector Block Protect and
Flash Memory Region ............................................................ 19
Hardware Data Protection ......................................................19
Low VCC Write Inhibit ............................................................ 19
Write Pulse “Glitch” Protection ............................................... 20
Logical Inhibit .......................................................................... 20
Power-Up Write Inhibit ............................................................ 20
Common Flash Memory Interface (CFI) . . . . . . . 20
Table 8. CFI Query Identification String.......................................... 20
Table 9. System Interface String......................................................21
Table 10. Device Geometry Definition ............................................ 21
Table 11. Primary Vendor-Specific Extended Query ...................... 22
Command Definitions . . . . . . . . . . . . . . . . . . . . . 23
Reading Array Data ................................................................ 23
Reset Command ..................................................................... 23
Autoselect Command Sequence ............................................ 23
Enter SecSi™ Sector/Exit SecSi Sector
Unprotect Timing Diagram ............................................................. 45
Alternate CE# Controlled Erase and Program Operations ..... 46
Figure 26. Alternate CE# Controlled Write (Erase/Program)
Operation Timings.......................................................................... 47
Erase And Programming Performance. . . . . . . . 48
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 48
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 48
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA)
Command Sequence .............................................................. 23
Byte/Word Program Command Sequence ............................. 24
Unlock Bypass Command Sequence ..................................... 24
Figure 3. Program Operation .......................................................... 25
Chip Erase Command Sequence ........................................... 25
Sector Erase Command Sequence ........................................ 25
12 x 11 mm package .............................................................. 49
LAA064—64-Ball Fortified Ball Grid Array (FBGA)
13 x 11 mm package .............................................................. 50
TS 048—48-Pin Standard TSOP ............................................51
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52
June 7, 2002
Am29DL640G
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