Datasheet > AM29DL164DB70VRF

AM29DL164DB70VRF

更新时间： 2024-02-27 15:38:48

品牌	Logo	应用领域
飞索 - SPANSION		内存集成电路闪存
页数	文件大小	规格书
57页	1243K
描述
Flash, 1MX16, 70ns, PBGA48, 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, VBGA-48

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AM29DL164DB70VRF 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, VBGA-48
针数：	48	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.32.00.51
风险等级：	5.84	最长访问时间：	70 ns
其他特性：	BOTTOM BOOT BLOCK	备用内存宽度：	8
启动块：	BOTTOM	命令用户界面：	YES
通用闪存接口：	YES	数据轮询：	YES
JESD-30 代码：	R-PBGA-B48	JESD-609代码：	e1
长度：	8.15 mm	内存密度：	16777216 bit
内存集成电路类型：	FLASH	内存宽度：	16
功能数量：	1	部门数/规模：	8,31
端子数量：	48	字数：	1048576 words
字数代码：	1000000	工作模式：	ASYNCHRONOUS
最高工作温度：	85 °C	最低工作温度：	-40 °C
组织：	1MX16	封装主体材料：	PLASTIC/EPOXY
封装代码：	VFBGA	封装等效代码：	BGA48,6X8,32
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行：	PARALLEL	峰值回流温度（摄氏度）：	260
电源：	3/3.3 V	编程电压：	3 V
认证状态：	Not Qualified	就绪/忙碌：	YES
座面最大高度：	1 mm	部门规模：	8K,64K
最大待机电流：	0.000005 A	子类别：	Flash Memories
最大压摆率：	0.045 mA	最大供电电压 (Vsup)：	3.6 V
最小供电电压 (Vsup)：	2.7 V	标称供电电压 (Vsup)：	3 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子面层：	TIN SILVER COPPER
端子形式：	BALL	端子节距：	0.8 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	40
切换位：	YES	类型：	NOR TYPE
宽度：	6.15 mm	Base Number Matches：	1

AM29DL164DB70VRF 数据手册

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D A T A S H E E T

Revision E + 2 (February 14, 2003)

Revision E5 (December 1, 2006)

Global

Added VBF048 package, Very Thin Profile Fine Pitch

Ball Grid Array, to Distinctive Characteristics, General

Description, Ordering Information, Connection Dia-

grams, and Physical Dimensions sections.

Changed SecSi to Secured Silicon.

Erase and Program Operations table

Changed t_BUSYto a maximum specification.

Revision E+3 (February 25, 2004)

Revision E6 (February 26, 2009)

AC Characteristics

Global

Corrected t_SR/Win Figure 20, Back-to-back Read/Write

Cycle Timings.

Added obsolescence information.

Revision E+4 (May 26, 2004)

Ordering Information

Added Pb-Free OPNs.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to

you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor de-

vices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design mea-

sures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those products.

Trademarks

marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are

for identification purposes only and may be trademarks of their respective companies.

ORNAND2^™, HD-SIM^™, EcoRAM^™and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used

are for informational purposes only and may be trademarks of their respective owners.

February 26, 2009 21533E6

Am29DL16xD

1...54 55 5657

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与AM29DL164DB70VRF相关器件

型号	品牌	描述	获取价格	数据表
AM29DL164DB70VRI	AMD	16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Mem	获取价格
AM29DL164DB70WCF	AMD	16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Mem	获取价格
AM29DL164DB70WCI	AMD	16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Mem	获取价格
AM29DL164DB70WCI	SPANSION	Flash, 1MX16, 70ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48	获取价格
AM29DL164DB70WCIN	ETC	x8/x16 Flash EEPROM	获取价格
AM29DL164DB80WCF	SPANSION	Flash, 2MX8, 80ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48	获取价格

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