AGR19125E
125 W, 1930 MHz—1990 MHz, PCS LDMOS RF Power Transistor
Table 1. Thermal Characteristics
Introduction
Parameter
Sym
Value
Unit
The AGR19125E is a 125 W, 28 V N-channel later-
ally diffused metal oxide semiconductor (LDMOS)
RF power field effect transistor (FET) suitable for
personal communication service (PCS)
(1930 MHz—1990 MHz), time-division multiple
access (TDMA), and single-carrier or multicarrier
class AB power amplifier applications.
Thermal Resistance,
Junction to Case:
AGR19125EU
Rı JC
Rı JC
0.5
0.5
°C/W
°C/W
AGR19125EF
Table 2. Absolute Maximum Ratings*
Parameter
Drain-source Voltage
Gate-source Voltage
Sym Value Unit
65 Vdc
VGS –0.5, +15 Vdc
VDSS
Total Dissipation at TC = 25 °C:
AGR19125EU
PD
PD
350
350
W
W
AGR19125EF
AGR19125EU (unflanged)
AGR19125EF (flanged)
Derate Above 25 °C:
AGR19125EU
AGR19125EF
—
—
TJ
2.0
2.0
W/°C
W/°C
°C
Figure 1. Available Packages
Operating Junction Tempera-
ture
200
Features
Storage Temperature Range
TSTG –65, +150 °C
Typical 2 carrier, N-CDMA performance for
VDD = 28 V, IDQ = 1250 mA, F1 = 1958.75 MHz,
F2 = 1961.25 MHz, IS-95 (pilot, paging, sync,
traffic channels 8—13) 1.2288 MHz channel
bandwidth (BW). Adjacent channels measured
over a 30 kHz BW at F1 – 0.885 MHz and
F2 + 0.885 MHz. Intermodulation distortion
products measured over a 1.2288 MHz BW at
F1 – 2.5 MHz and F2 + 2.5 MHz. Peak/Average
(P/A) = 9.72 dB at 0.01% probability on CCDF:
— Output power: 24 W.
* Stresses in excess of the absolute maximum ratings can cause
permanent damage to the device. These are absolute stress rat-
ings only. Functional operation of the device is not implied at
these or any other conditions in excess of those given in the
operational sections of the data sheet. Exposure to absolute
maximum ratings for extended periods can adversely affect
device reliability.
Table 3. ESD Rating*
AGR19125E
HBM
Minimum (V)
Class
500
50
1B
A
MM
— Power gain: 15 dB.
— Efficiency: 24%.
CDM
1500
4
* Although electrostatic discharge (ESD) protection circuitry has
been designed into this device, proper precautions must be
taken to avoid exposure to ESD and electrical overstress (EOS)
— ACPR: –48 dBc.
— IMD3: –34 dBc.
— Return loss: –10 dB.
PEAK Devices
during all handling, assembly, and test operations. Agere
employs a human-body model (HBM), a machine model (MM),
and a charged-device model (CDM) qualification requirement in
order to determine ESD-susceptibility limits and protection
design evaluation. ESD voltage thresholds are dependent on the
circuit parameters used in each of the models, as defined by
JEDEC's JESD22-A114B (HBM), JESD22-A115A (MM), and
JESD22-C101A (CDM) standards.
High-reliability, gold-metalization process.
Low hot carrier injection (HCI) induced bias drift
over 20 years.
Internally matched.
High gain, efficiency, and linearity.
Integrated ESD protection.
Caution: MOS devices are susceptible to damage from elec-
trostatic charge. Reasonable precautions in han-
dling and packaging MOS devices should be
observed.
Device can withstand a 10:1 voltage standing wave
ratio (VSWR) at 28 Vdc, 1960 MHz, 125 W contin-
uous wave (CW) output power.
Large signal impedance parameters available.