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AGR26125E PDF预览

AGR26125E

更新时间: 2024-02-10 07:27:26
品牌 Logo 应用领域
TRIQUINT 电子
页数 文件大小 规格书
9页 367K
描述
125 W, 2.5 GHz-2.7 GHz, N-Channel E-Mode, Lateral MOSFET

AGR26125E 技术参数

生命周期:ActiveReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.21
其他特性:HIGH RELIABILITY外壳连接:SOURCE
配置:SINGLE最小漏源击穿电压:65 V
FET 技术:METAL-OXIDE SEMICONDUCTOR最高频带:S BAND
JESD-30 代码:R-CDFP-F2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:FLATPACK极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

AGR26125E 数据手册

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AGR26125E  
125 W, 2.5 GHz—2.7 GHz, N-Channel E-Mode, Lateral MOSFET  
Table 1. Thermal Characteristics  
Introduction  
Parameter  
Sym  
Value  
Unit  
The AGR26125E is a high-voltage, gold-metalized,  
enhancement mode, laterally diffused metal oxide  
semiconductor (LDMOS) RF power transistor suit-  
able for ultrahigh-frequency (UHF) applications  
including multichannel multipoint distribution service  
(MMDS) for broadcasting and communications.  
Thermal Resistance,  
Junction to Case:  
AGR26125EU  
Rı JC  
Rı JC  
0.5  
0.5  
°C/W  
°C/W  
AGR26125EF  
Table 2. Absolute Maximum Ratings*  
Parameter  
Drain-source Voltage  
Gate-source Voltage  
Sym Value Unit  
65 Vdc  
VGS –0.5, +15 Vdc  
VDSS  
5B 03 STYLE 1  
Total Dissipation at TC = 25 °C:  
AGR26125EU  
AGR26125EU (unflanged) AGR26125EF (flanged)  
PD  
PD  
350  
350  
W
W
AGR26125EF  
Figure 1. Available Packages  
Derate Above 25 °C:  
AGR26125EU  
AGR26125EF  
TJ  
2.0  
2.0  
200  
W/°C  
W/°C  
°C  
Features  
Operating Junction Tempera-  
ture  
Typical pulsed P1dB, 6 µs pulse at 10% duty: 125 W  
Typical performance for MMDS systems.  
f = 2600 MHz, IDQ = 1300 mA, Vds = 28 V,  
adjacent channel BW = 3.84 MHz, 5 MHz offset;  
alternate channel BW = 3.84 MHz, 10 MHz offset.  
Typical P/A ratio of 9.8 dB at 0.01% (probability)  
CCDF*:  
.
Storage Temperature Range  
TSTG –65, +150 °C  
* Stresses in excess of the absolute maximum ratings can cause  
permanent damage to the device. These are absolute stress rat-  
ings only. Functional operation of the device is not implied at  
these or any other conditions in excess of those given in the  
operational sections of the data sheet. Exposure to absolute  
maximum ratings for extended periods can adversely affect  
device reliability.  
— Output power: 20 W  
— Power gain: 11.5 dB.  
— Power Added Efficiency (PAE): 19%.  
— ACLR1: –35 dBc.  
— ACLR2: –37 dBc.  
High-reliability, gold-metalization process.  
Low hot carrier injection (HCI) induced bias drift  
over 20 years.  
Table 3. ESD Rating*  
AGR26125E  
HBM  
Minimum (V)  
Class  
500  
50  
1B  
A
MM  
CDM  
1500  
4
Internally matched.  
* Although electrostatic discharge (ESD) protection circuitry has  
been designed into this device, proper precautions must be  
taken to avoid exposure to ESD and electrical overstress (EOS)  
High gain, efficiency, and linearity.  
Integrated ESD protection.  
Device can withstand a 10:1 voltage standing wave  
ratio (VSWR) at 28 Vdc, 2600 MHz, 125 W contin-  
uous wave (CW) output power.  
PEAK Devices  
during all handling, assembly, and test operations.
employs a human-body model (HBM), a machine model (MM),  
and a charged-device model (CDM) qualification requirement in  
order to determine ESD-susceptibility limits and protection  
design evaluation. ESD voltage thresholds are dependent on the  
circuit parameters used in each of the models, as defined by  
JEDEC's JESD22-A114B (HBM), JESD22-A115A (MM), and  
JESD22-C101A (CDM) standards.  
Large signal impedance parameters available.  
*The test signal utilized is 4-channel W-CDMA Test Model 1. This  
test signal provides an equivalent reference (occupied bandwidth  
and waveform EPF) for the actual performance with an MMDS  
waveform.  
Caution: MOS devices are susceptible to damage from elec-  
trostatic charge. Reasonable precautions in han-  
dling and packaging MOS devices should be  
observed.  

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