Datasheet > AFE882H1

AFE882H1

更新时间： 2024-04-09 18:59:37

品牌	Logo	应用领域
德州仪器 - TI		传感器
页数	文件大小	规格书
113页	4984K
描述
适用于 PLC 和传感器变送器应用且具有 HART®、16 位 DAC 和 12 位 ADC 的低功耗 AFE

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中文翻译

获取价格

数据手册

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AFE882H1 数据手册

EXAMPLE BOARD LAYOUT

RRU0024A

UQFN - 0.7 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

SYMM

SEE SOLDER MASK

DETAIL

24X (0.7)

24X (0.25)

20X (0.5)

SYMM

(3.7)

(R0.05) TYP

(3.7)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 20X

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

METAL UNDER

SOLDER MASK

METAL EDGE

EXPOSED METAL

SOLDER MASK

OPENING

EXPOSED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4225850/A 04/2020

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

1...108 109 110111112 113

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