ADuM6410/ADuM6411/ADuM6412
Data Sheet
APPLICATIONS INFORMATION
To reduce the level of electromagnetic radiation, the impedance
to high frequency currents between the VISO and GNDISO pins
and the PCB trace connections can be increased. Using this
method of EMI suppression controls the radiating signal at its
source by placing surface-mount ferrite beads in series with the
PCB LAYOUT
The ADuM6410/ADuM6411/ADuM6412 digital isolators with
0.15 W isoPower integrated dc-to-dc converters require no
external interface circuitry for the logic interfaces. Power supply
bypassing is required at the input and output supply pins (see
Figure 32). Note that low ESR bypass capacitors of 0.01 µF to
0.1 µF value are required between the VDD1 pin and GND1 pin,
and between the VDD2 pin and GNDISO pin, as close to the chip
pads as possible, for proper operation of the data channels. The
isoPower inputs require several passive components to bypass
the power effectively as well as set the output voltage and bypass
the core voltage regulator (see Figure 30 through Figure 32).
V
ISO and GNDISO pins, as seen in Figure 32. The impedance of
the ferrite bead is chosen to be about 2 kΩ between the 100
MHz and 1 GHz frequency range, to reduce the emissions at the
125 MHz primary switching frequency and the 250 MHz
secondary side rectifying frequency and harmonics. See Table
33 for examples of appropriate surface-mount ferrite beads. For
additional reduction in emissions, PCB stitching capacitance
can be implemented with a high voltage SMT safety capacitor.
For optimal performance, it is important that the capacitor is
connected directly between GND1 (Pin 12) and GNDISO (Pin 13),
as shown in Figure 32. This capacitor is a SMT Size 1812, has a
3 kV voltage rating, and is manufactured by TDK Corporation
(C4532C0G3F101K160KA).
PDIS
10
V
DDP
11
12
GND
1
+
10µF
0.1µF
Figure 30. VDDP Bias and Bypass Components
Table 33. Surface-Mount Ferrite Beads Example
V
V
SEL
R2
15
14
13
Manufacturer
Taiyo Yuden
Part No.
BKH1005LM182-T
BLM15HD182SN1
30kΩ
FB1
ISO
VISO OUT
GND
ISO
Murata Electronics
0.1µF
10µF
FB2
R1
10kΩ
ISO GND
V
V
DD1
DD2
0.1µF
0.1µF
GND
1
GND
ISO
Figure 31. VISO Bias and Bypass Components
V
V
V
V
/V
V
V
V
V
V
/V
IA OA
OA IA
/V
/V
The power supply section of the ADuM6410/ADuM6411/
ADuM6412 uses a 125 MHz oscillator frequency to efficiently
pass power through its chip-scale transformers. Bypass capacitors
are required for several operating frequencies. Noise suppression
requires a low inductance, high frequency capacitor; ripple
suppression and proper regulation require a large value capacitor.
These capacitors are most conveniently connected between the
IB OB
OB IB
/V
/V
IC OC
OC IC
ADuM6410/
ADuM6411/
ADuM6412
/V
/V
ID OD
OD ID
V
E1
E2
NIC
NIC
GND
1
GND
ISO
PDIS
V
SEL
ISO
V
V
DDP
GND
1
GND
ISO
V
DDP pin and GND1 pin, and between the VISO pin and GNDISO pin.
10µF 0.1µF
0.1µF FERRITES 10µF
To suppress noise and reduce ripple, a parallel combination of at least
two capacitors is required. The recommended capacitor values are
0.1 µF and 10 µF for VDD1. The smaller capacitor must have a low
ESR; for example, use of a ceramic capacitor is advised. Note that
the total lead length between the ends of the low ESR capacitor
and the input power supply pin must not exceed 2 mm. Installing
the bypass capacitor with traces more than 2 mm in length may
result in data corruption.
SMT 100pF SAFETY CAPACITOR
NIC = NO INTERNAL CONNECTION. LEAVE THIS PIN FLOATING.
Figure 32. Recommended PCB Layout
In applications involving high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling
that does occur equally affects all pins on a given component
side. Failure to ensure these steps can cause voltage differentials
between pins, exceeding the absolute maximum ratings specified in
Table 26, thereby leading to latch-up and/or permanent damage.
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