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ADUM221N1BRWZ PDF预览

ADUM221N1BRWZ

更新时间: 2024-01-14 11:34:06
品牌 Logo 应用领域
亚德诺 - ADI 光电二极管
页数 文件大小 规格书
23页 571K
描述
ADUM221N1BRWZ

ADUM221N1BRWZ 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active包装说明:SOP,
针数:16Reach Compliance Code:compliant
风险等级:2.13模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:R-PDSO-G16JESD-609代码:e3
长度:10.3 mm湿度敏感等级:3
功能数量:1端子数量:16
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260座面最大高度:2.65 mm
最大供电电压 (Vsup):5 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.5 mm
Base Number Matches:1

ADUM221N1BRWZ 数据手册

 浏览型号ADUM221N1BRWZ的Datasheet PDF文件第17页浏览型号ADUM221N1BRWZ的Datasheet PDF文件第18页浏览型号ADUM221N1BRWZ的Datasheet PDF文件第19页浏览型号ADUM221N1BRWZ的Datasheet PDF文件第21页浏览型号ADUM221N1BRWZ的Datasheet PDF文件第22页浏览型号ADUM221N1BRWZ的Datasheet PDF文件第23页 
ADuM220N/ADuM221N/ADuM225N/ADuM226N  
Data Sheet  
APPLICATIONS INFORMATION  
Pulse width distortion is the maximum difference between these  
two propagation delay values and is an indication of how  
accurately the timing of the input signal is preserved.  
PCB LAYOUT  
The ADuM220N/ADuM221N/ADuM225N/ADuM226N  
digital isolators require no external interface circuitry for the  
logic interfaces. Power supply bypassing is strongly recom-  
mended at the input and output supply pins (see Figure 19 and  
Figure 20). For the ADuM225N/ADuM226N, bypass capacitors  
are most conveniently connected between Pin 1 and Pin 4 for  
Channel matching is the maximum amount the propagation  
delay differs between channels within a single ADuM220N/  
ADuM221N/ADuM225N/ADuM226N component.  
Propagation delay skew is the maximum amount the propaga-  
tion delay differs between multiple ADuM220N/ADuM221N/  
ADuM225N/ADuM226N components operating under the  
same conditions.  
V
DD1 and between Pin 5 and Pin 8 for VDD2. For the ADuM220N/  
ADuM221N, bypass capacitors are most conveniently con-  
nected between Pin 1 and Pin 3 for VDD1 and between Pin 14  
and Pin 16 for VDD2. The recommended bypass capacitor value is  
between 0.01 µF and 0.1 µF. The total lead length between both  
ends of the capacitor and the input power supply pin must not  
exceed 10 mm. For the ADuM220N/ADuM221N, bypassing  
between Pin 3 and Pin 7 and between Pin 9 and Pin 14 must  
also be considered, unless the ground pair on each package side  
are connected close to the package.  
JITTER MEASUREMENT  
Figure 22 shows the eye diagram for the ADuM220N/  
ADuM221N/ADuM225N/ADuM226N. The measurement  
was taken using an Agilent 81110A pulse pattern generator at  
150 Mbps with pseudorandom bit sequences (PRBS) 2(n − 1),  
n = 14, for 5 V supplies. Jitter was measured with the Tektronix  
Model 5104B oscilloscope, 1 GHz, 10 GSPS with the DPOJET  
jitter and eye diagram analysis tools. The result shows a typical  
measurement on the ADuM220N/ADuM221N/ADuM225N/  
ADuM226N with 380 ps p-p jitter.  
GND  
GND  
1
2
NIC  
NIC  
V
V
DD2  
DD1  
V
, V  
V
, V  
OA IA  
OB  
IA OA  
V
V
IB  
NIC  
NIC  
NIC  
GND  
5
4
3
2
1
0
GND  
1
NIC  
2
Figure 19. Recommended PCB Layout for ADuM220N/ADuM221N  
V
V
V
V
, V  
DD2  
DD1  
V
, V  
IA OA  
OA IA  
OB  
V
IB  
GND  
1
GND  
2
Figure 20. Recommended PCB Layout for ADuM225N/ADuM226N  
In applications involving high common-mode transients, ensure  
that board coupling across the isolation barrier is minimized.  
Furthermore, design the board layout such that any coupling  
that does occur equally affects all pins on a given component  
side. Failure to ensure this can cause voltage differentials between  
pins exceeding the Absolute Maximum Ratings of the device,  
thereby leading to latch-up or permanent damage.  
–10  
–5  
0
5
10  
TIME (ns)  
Figure 22. ADuM220N/ADuM221N/ADuM225N/ADuM226N Eye Diagram  
INSULATION LIFETIME  
All insulation structures eventually break down when subjected  
to voltage stress over a sufficiently long period. The rate of insula-  
tion degradation is dependent on the characteristics of the voltage  
waveform applied across the insulation as well as on the materials  
and material interfaces.  
See the AN-1109 Application Note for board layout guidelines.  
PROPAGATION DELAY RELATED PARAMETERS  
Propagation delay is a parameter that describes the time it takes  
a logic signal to propagate through a component. The propagation  
delay to a Logic 0 output may differ from the propagation delay  
to a Logic 1 output.  
The two types of insulation degradation of primary interest are  
breakdown along surfaces exposed to the air and insulation  
wear out. Surface breakdown is the phenomenon of surface  
tracking, and the primary determinant of surface creepage  
requirements in system level standards. Insulation wear out is the  
phenomenon where charge injection or displacement currents  
inside the insulation material cause long-term insulation  
degradation.  
INPUT (V  
)
50%  
Ix  
tPLH  
tPHL  
OUTPUT (V  
)
50%  
Ox  
Figure 21. Propagation Delay Parameters  
Rev. A | Page 20 of 23  
 
 
 
 
 
 
 
 

ADUM221N1BRWZ 替代型号

型号 品牌 替代类型 描述 数据表
ADuM221N1BRWZ-RL ADI

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