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ADTF3175 PDF预览

ADTF3175

更新时间: 2023-12-20 18:44:33
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
2页 145K
描述
100万像素飞行时间模块

ADTF3175 数据手册

 浏览型号ADTF3175的Datasheet PDF文件第2页 
Data Sheet  
ADTF3175  
1 MegaPixel Time-of-Flight Module  
FEATURES  
GENERAL DESCRIPTION  
1024 × 1024 ToF imager with 3.5 µm × 3.5 µm pixels  
75° × 75° field of view  
Imager lens subassembly with 940 nm band-pass filter  
Illumination subassembly with eye safety support  
4-lane MIPI CSI-2 transmitter interface, 1.5 Gbps per lane  
4-wire SPI and 2-wire I2C serial interfaces  
NVM (Flash) for module boot-up sequence  
Power regulators for local imager and illumination rails  
Calibrated modes at 1024 × 1024 and 512 × 512 resolutions  
Depth range: 0.4 m to 4 m (depth noise (1 σ) 15 mm maximum,  
19% minimum target reflectance, 3 klux equivalent sunlight)  
Depth accuracy: ±5 mm (across full depth range)  
Available in 50-lead, MODULE, ML-50-1 package  
The ADTF3175 is a complete Time-of-Flight (ToF) module for high  
resolution 3D depth sensing and vision systems. Based on the  
ADSD3100, a 1 megapixel CMOS indirect ToF (iToF) imager, the  
ADTF3175 also integrates the lens and optical band-pass filter for  
the imager, an infrared illumination source containing optics, laser  
diode, laser diode driver and photodetector, a flash memory, and  
power regulators to generate local supply voltages. The module is  
fully calibrated at multiple range and resolution modes. To complete  
the depth sensing system, the raw image data from the ADTF3175  
is processed externally by the host system processor or depth  
image signal processor (ISP).  
The ADTF3175 image data output interfaces electrically to the host  
system over a 4-lane mobile industry processor interface (MIPI),  
Camera Serial Interface 2 (CSI-2) transmitter interface. The module  
programming and operation are controlled through 4-wire serial  
peripheral interface (SPI) and I2C interface.  
APPLICATIONS  
The ADTF3175 has module dimensions of 42 mm × 31 mm × 15.1  
mm and is specified over an operating temperature range of −20°C  
to 65°C.  
Machine vision systems  
Robotics  
Building automation  
Augmented reality (AR) systems  
MODULE FUNCTIONAL BLOCK DIAGRAM  
Figure 1. Module Functional Block Diagram  
For more information about the ADTF3175, contact tof@analog.com.  
Rev. Sp0  
Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog  
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to  
change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and  
registered trademarks are the property of their respective owners.  
DOCUMENT FEEDBACK  
TECHNICAL SUPPORT  

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