Datasheet > ADTF3175

ADTF3175

更新时间： 2024-11-24 14:57:35

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亚德诺 - ADI		/
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2页	145K
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100万像素飞行时间模块

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ADTF3175 数据手册

Data Sheet

ADTF3175

1 MegaPixel Time-of-Flight Module

FEATURES

GENERAL DESCRIPTION

► 1024 × 1024 ToF imager with 3.5 µm × 3.5 µm pixels

► 75° × 75° field of view

► Imager lens subassembly with 940 nm band-pass filter

► Illumination subassembly with eye safety support

► 4-lane MIPI CSI-2 transmitter interface, 1.5 Gbps per lane

► 4-wire SPI and 2-wire I²C serial interfaces

► NVM (Flash) for module boot-up sequence

► Power regulators for local imager and illumination rails

► Calibrated modes at 1024 × 1024 and 512 × 512 resolutions

► Depth range: 0.4 m to 4 m (depth noise (1 σ) 15 mm maximum,

19% minimum target reflectance, 3 klux equivalent sunlight)

► Depth accuracy: ±5 mm (across full depth range)

► Available in 50-lead, MODULE, ML-50-1 package

The ADTF3175 is a complete Time-of-Flight (ToF) module for high

resolution 3D depth sensing and vision systems. Based on the

ADSD3100, a 1 megapixel CMOS indirect ToF (iToF) imager, the

ADTF3175 also integrates the lens and optical band-pass filter for

the imager, an infrared illumination source containing optics, laser

diode, laser diode driver and photodetector, a flash memory, and

power regulators to generate local supply voltages. The module is

fully calibrated at multiple range and resolution modes. To complete

the depth sensing system, the raw image data from the ADTF3175

is processed externally by the host system processor or depth

image signal processor (ISP).

The ADTF3175 image data output interfaces electrically to the host

system over a 4-lane mobile industry processor interface (MIPI),

Camera Serial Interface 2 (CSI-2) transmitter interface. The module

programming and operation are controlled through 4-wire serial

peripheral interface (SPI) and I²C interface.

APPLICATIONS

The ADTF3175 has module dimensions of 42 mm × 31 mm × 15.1

mm and is specified over an operating temperature range of −20°C

to 65°C.

► Machine vision systems

► Robotics

► Building automation

► Augmented reality (AR) systems

MODULE FUNCTIONAL BLOCK DIAGRAM

Figure 1. Module Functional Block Diagram

For more information about the ADTF3175, contact tof@analog.com.

Rev. Sp0

Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog

Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to

change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and

registered trademarks are the property of their respective owners.

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