Datasheet > ADSP-21367_06

ADSP-21367_06

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
56页	1696K
描述
SHARC Processors

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数据手册

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ADSP-21367_06 数据手册

ADSP-21367/ADSP-21368/ADSP-21369

TABLE OF CONTENTS

Summary ................................................................1

Key Features—Processor Core ..................................2

Input/Output Features ............................................2

Dedicated Audio Components ..................................2

General Description ..................................................4

Core Architecture ..................................................4

Memory Architecture .............................................5

External Memory ...................................................5

Input/Output Features ............................................7

System Design .......................................................9

Development Tools .............................................. 10

Additional Information ......................................... 11

Pin Function Descriptions ........................................ 12

Data Modes ........................................................ 15

Boot Modes ........................................................ 15

Core Instruction Rate to CLKIN Ratio Modes ............. 15

Specifications ......................................................... 16

Operating Conditions ........................................... 16

Electrical Characteristics ........................................ 17

Package Information ............................................ 18

Maximum Power Dissipation ................................. 18

Absolute Maximum Ratings ................................... 18

ESD Sensitivity .................................................... 18

Timing Specifications ........................................... 19

Output Drive Currents .......................................... 47

Test Conditions ................................................... 47

Capacitive Loading ............................................... 47

Thermal Characteristics ........................................ 48

256-Ball SBGA Pinout .............................................. 49

208-Lead MQFP Pinout ............................................ 52

Package Dimensions ................................................ 54

Surface-Mount Design .......................................... 55

Ordering Guide ...................................................... 56

Rev. A

Page 3 of 56

August 2006

1 234 5 6 7...56

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