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ADSP-21261 PDF预览

ADSP-21261

更新时间: 2024-01-12 23:56:59
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
44页 1232K
描述
SHARC Embedded Processor

ADSP-21261 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:MO-205-AE, CSP, BGA-136针数:136
Reach Compliance Code:not_compliantECCN代码:3A991.A.2
HTS代码:8542.31.00.01风险等级:5.55
地址总线宽度:16桶式移位器:YES
位大小:32边界扫描:YES
最大时钟频率:50 MHz外部数据总线宽度:16
格式:FLOATING POINT内部总线架构:MULTIPLE
JESD-30 代码:S-PBGA-B136JESD-609代码:e0
长度:12 mm低功率模式:NO
端子数量:136最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA136,14X14,32
封装形状:SQUARE封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.2,3.3 V
认证状态:Not QualifiedRAM(字数):32768
座面最大高度:1.7 mm子类别:Digital Signal Processors
最大压摆率:375 mA最大供电电压:1.26 V
最小供电电压:1.14 V标称供电电压:1.2 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:12 mmuPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches:1

ADSP-21261 数据手册

 浏览型号ADSP-21261的Datasheet PDF文件第1页浏览型号ADSP-21261的Datasheet PDF文件第2页浏览型号ADSP-21261的Datasheet PDF文件第4页浏览型号ADSP-21261的Datasheet PDF文件第5页浏览型号ADSP-21261的Datasheet PDF文件第6页浏览型号ADSP-21261的Datasheet PDF文件第7页 
ADSP-21261  
TABLE OF CONTENTS  
General Description ................................................. 4  
ADSP-21261 Family Core Architecture ...................... 4  
SIMD Computational Engine ............................... 4  
Independent, Parallel Computation Units ................ 4  
Data Register File ............................................... 5  
Reset ............................................................. 20  
Interrupts ....................................................... 20  
Core Timer ..................................................... 20  
Timer PWM_OUT Cycle Timing ......................... 21  
Timer WDTH_CAP Timing ............................... 21  
DAI Pin-to-Pin Direct Routing ............................ 22  
Precision Clock Generator (Direct Pin Routing) ...... 23  
Flags ............................................................. 24  
Memory Read—Parallel Port ............................... 25  
Memory Write—Parallel Port ............................. 27  
Serial Ports ..................................................... 29  
Input Data Port (IDP) ....................................... 32  
Parallel Data Acquisition Port (PDAP) .................. 33  
SPI Protocol—Master ........................................ 34  
SPI Protocol—Slave .......................................... 34  
JTAG Test Access Port and Emulation .................. 36  
Output Drive Currents ......................................... 37  
Test Conditions .................................................. 37  
Capacitive Loading .............................................. 37  
Environmental Conditions .................................... 38  
Thermal Characteristics ........................................ 38  
136-Ball BGA Pin Configurations ............................... 39  
144-Lead LQFP Pin Configurations ............................ 42  
Package Dimensions ............................................... 43  
Surface Mount Design .......................................... 44  
Ordering Guide ..................................................... 44  
Single-Cycle Fetch of Instruction and  
Four Operands ............................................... 5  
Instruction Cache .............................................. 5  
Data Address Generators with Zero-Overhead  
Hardware Circular Buffer Support ...................... 5  
Flexible Instruction Set ....................................... 6  
ADSP-21261 Memory and I/O Interface Features ......... 6  
Dual-Ported On-Chip Memory ............................. 6  
DMA Controller ................................................ 6  
Digital Applications Interface (DAI) ....................... 6  
Serial Ports ....................................................... 6  
Serial Peripheral (Compatible) Interface .................. 7  
Parallel Port ..................................................... 7  
Timers ............................................................ 8  
Program Booting ............................................... 8  
Phase-Locked Loop ............................................ 8  
Power Supplies .................................................. 8  
Target Board JTAG Emulator Connector .................... 8  
Development Tools ............................................... 8  
Evaluation Kit ..................................................... 10  
Designing an Emulator-Compatible  
DSP Board (Target) ........................................... 10  
Additional Information ......................................... 10  
Pin Function Descriptions ........................................ 11  
Address Data Pins as Flags ..................................... 14  
Boot Modes ........................................................ 14  
Core Instruction Rate to CLKIN Ratio Modes ............. 14  
Address Data Modes ............................................. 14  
ADSP-21261 Specifications ....................................... 15  
Recommended Operating Conditions ....................... 15  
Electrical Characteristics ........................................ 15  
Absolute Maximum Ratings ................................... 16  
ESD Sensitivity .................................................... 16  
Timing Specifications ........................................... 17  
Power-Up Sequencing ....................................... 18  
Clock Input ..................................................... 19  
Clock Signals ................................................... 19  
REVISION HISTORY  
3/06—Rev. 0: Initial Release  
Rev. 0  
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Page 3 of 44 | March 2006  

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