Datasheet > ADSP-21061_15

ADSP-21061_15

更新时间： 2022-02-26 13:50:54

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
52页	870K
描述
Commercial Grade SHARC DSP Microcomputer

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ADSP-21061_15 数据手册

ADSP-21061/ADSP-21061L

ENVIRONMENTAL CONDITIONS

Thermal Characteristics

The ADSP-21061 is available in 240-lead thermally enhanced

MQFP package. The top surface of the thermally enhanced

MQFP contains a metal slug from which most of the die heat is

dissipated. The slug is flush with the top surface of the package.

Note that the metal slug is internally connected to GND

through the device substrate.

The ADSP-21061L is available in 240-lead MQFP and 225-ball

plastic BGA packages.

All packages are specified for a case temperature (T_CASE). To

ensure that the T_CASEis not exceeded, a heatsink and/or an air-

flow source may be used. A heat sink should be attached with a

thermal adhesive.

T_CASE= T_AMB+ (PD _CA)

T_CASE= Case temperature (measured on top surface of package)

T_AMB= Ambient temperature C

PD =Power dissipation in W (this value depends upon the spe-

cific application; a method for calculating PD is shown under

Power Dissipation).

_CA=Value from tables below.

Table 29. ADSP-21061 (5 V Thermally Enhanced ED/MQFP

Package)

Parameter Condition (Linear Ft./Min.) Typical Unit

_CA

Airflow = 0

°C/W

Airflow = 100

Airflow = 200

Airflow = 400

Airflow = 600

Table 30. ADSP-21061L (3.3 V MQFP Package)

Parameter Condition (Linear Ft./Min.) Typical Unit

_CA

Airflow = 0

19.6

17.6

15.6

13.9

12.2

°C/W

Airflow = 100

Airflow = 200

Airflow = 400

Airflow = 600

Table 31. ADSP-21061L (3.3 V PBGA Package)

Parameter Condition (Linear Ft./Min.) Typical Unit

_CA

Airflow = 0

Airflow = 200

Airflow = 400

19.0

13.6

11.2

°C/W

Rev. D

| Page 46 of 52 | May 2013

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