ADSP-21061/ADSP-21061L
SURFACE-MOUNT DESIGN
Table 34 is provided as an aide to PCB design. For industry-standard design recommendations, refer to IPC-7351, Generic Requirements
for Surface-Mount Design and Land Pattern Standard.
Table 34. BGA Data for Use with Surface-Mount Design
Package
Ball Attach Type
Solder Mask Opening
Ball Pad Size
225-Ball Grid Array (PBGA)
Solder Mask Defined
0.63 mm diameter
0.73 mm diameter
ORDERING GUIDE
Temperature
Range
Instruction On-Chip Operating
Package
Option
Model
Notes
Rate
SRAM
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
1M Bit
Voltage
Package Description
ADSP-21061KS-133
ADSP-21061KSZ-133
ADSP-21061KS-160
ADSP-21061KSZ-160
ADSP-21061KS-200
ADSP-21061KSZ-200
ADSP-21061LKB-160
ADSP-21061LKBZ-160
ADSP-21061LKSZ-160
ADSP-21061LASZ-176
ADSP-21061LKSZ-176
1 Z = RoHS Compliant Part.
0C to 85C
0C to 85C
0C to 85C
0C to 85C
0C to 85C
0C to 85C
0C to 85C
0C to 85C
0C to 85C
33 MHz
33 MHz
40 MHz
40 MHz
50 MHz
50 MHz
40 MHz
40 MHz
40 MHz
5 V
240-Lead MQFP_ED
240-Lead MQFP_ED
240-Lead MQFP_ED
240-Lead MQFP_ED
240-Lead MQFP_ED
240-Lead MQFP_ED
225-Ball PBGA
SP-240-2
SP-240-2
SP-240-2
SP-240-2
SP-240-2
SP-240-2
B-225-2
B-225-2
S-240
1
5 V
5 V
1
1
5 V
5 V
5 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
1
1
1
1
225-Ball PBGA
240-Lead MQFP
–40C to +85C 44 MHz
0C to 85C 44 MHz
240-Lead MQFP
S-240
240-Lead MQFP
S-240
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registered trademarks are the property of their respective owners.
D00170-0-5/13(D)
Rev. D
| Page 52 of 52 | May 2013