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ADS131E08SPAGR PDF预览

ADS131E08SPAGR

更新时间: 2024-02-20 23:24:54
品牌 Logo 应用领域
德州仪器 - TI 监控
页数 文件大小 规格书
70页 1650K
描述
用于电源监控和保护、具有快速启动功能的 24 位 64kSPS 8 通道同步采样 Δ-Σ ADC | PAG | 64 | -40 to 105

ADS131E08SPAGR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:TFQFP,
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:1.55其他特性:IT ALSO REQUIRES 1.8 V
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:S-PQFP-G64
JESD-609代码:e4长度:10 mm
湿度敏感等级:3信道数量:8
功能数量:1端子数量:64
最高工作温度:105 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:TFQFP
封装形状:SQUARE封装形式:FLATPACK, THIN PROFILE, FINE PITCH
座面最大高度:1 mm最大供电电压 (Vsup):5.25 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):5 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
宽度:10 mmBase Number Matches:1

ADS131E08SPAGR 数据手册

 浏览型号ADS131E08SPAGR的Datasheet PDF文件第3页浏览型号ADS131E08SPAGR的Datasheet PDF文件第4页浏览型号ADS131E08SPAGR的Datasheet PDF文件第5页浏览型号ADS131E08SPAGR的Datasheet PDF文件第7页浏览型号ADS131E08SPAGR的Datasheet PDF文件第8页浏览型号ADS131E08SPAGR的Datasheet PDF文件第9页 
ADS131E08S  
ZHCSEJ3B JUNE 2015REVISED APRIL 2020  
www.ti.com.cn  
Pin Functions (continued)  
PIN  
TYPE  
DESCRIPTION  
NAME  
START  
NO.  
38  
18  
17  
28  
30  
55  
26  
25  
24  
Digital input  
Analog input/output  
Analog input/output  
Analog output  
Analog output  
Analog output  
Analog output  
Analog input  
Start conversion  
TESTN(1)  
TESTP(1)  
VCAP1  
VCAP2  
VCAP3  
VCAP4  
VREFN  
VREFP  
Test signal, negative pin; connect to DGND with a 10-kΩ resistor if unused  
Test signal, positive pin; connect to DGND with a 10-kΩ resistor if unused  
Analog bypass capacitor; connect a 470-pF capacitor to AVSS  
Analog bypass capacitor; connect a 270-nF capacitor to AVSS  
Analog bypass capacitor; connect a 270-nF capacitor to AVSS  
Analog bypass capacitor; connect a 270-nF capacitor to AVSS  
Negative reference voltage; connect to AVSS  
Analog output  
Positive reference voltage output; connect a 330-nF capacitor to VREFN  
7 Specifications  
7.1 Absolute Maximum Ratings  
over operating ambient temperature range (unless otherwise noted)(1)  
MIN  
–0.3  
MAX  
5.5  
UNIT  
V
AVDD to AVSS  
DVDD to DGND  
–0.3  
3.9  
V
AVSS to DGND  
–3  
0.2  
V
Analog input voltage  
AVSS – 0.3  
DGND – 0.3  
DGND – 0.3  
–10  
AVDD + 0.3  
DVDD + 0.3  
DVDD + 0.3  
10  
V
Digital input voltage  
V
Digital output voltage  
V
Continuous input current to any pin except supply pins(2)  
Junction temperature, TJ  
Storage temperature, Tstg  
mA  
°C  
°C  
–40  
150  
–60  
150  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing beyond the supply rails must be current limited to 10  
mA or less.  
7.2 ESD Ratings  
VALUE  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
±2000  
V(ESD)  
Electrostatic discharge  
V
Charged-device model (CDM), per JEDEC specification JESD22-C101 or  
ANSI/ESDA/JEDEC JS-002(2)  
±500  
(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.  
6
Copyright © 2015–2020, Texas Instruments Incorporated  

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