ADP3110
ABSOLUTE MAXIMUM RATINGS
Table 2.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. Unless otherwise specified all other voltages
are referenced to PGND.
Parameter
Rating
VCC
BST
BST to SW
SW
–0.3 V to +15 V
–0.3 V to VCC + 15 V
–0.3 V to +15 V
DC
–5 V to +15 V
–10 V to +25 V
<200 ns
DRVH
DC
SW – 0.3 V to BST + 0.3 V
SW – 2 V to BST + 0.3 V
<200 ns
DRVL
DC
–0.3 V to VCC + 0.3 V
–2 V to VCC + 0.3 V
–0.3 V to 6.5 V
<200 ns
OD
IN,
θJA, SOIC_N
2-Layer Board
4-Layer Board
123°C/W
90°C/W
Operating Ambient Temperature
Range
0°C to 85°C
Junction Temperature Range
Storage Temperature Range
Lead Temperature Range
Soldering (10 sec)
0°C to 150°C
–65°C to +150°C
300°C
215°C
260°C
Vapor Phase (60 sec)
Infrared (15 sec)
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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